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Research Paper

Integrated Double-Sided Neural Sensor With Dry-Etch BCB

[+] Author and Article Information
Bruce Kim

Department of Electrical and Computer Engineering, University of Alabama, 101 Houser Hall, Tuscaloosa, AL 35487

Haixin Zhu, Jiping He

The Biodesign Institute, Arizona State University, 727 E. Tyler St. Tempe, AZ 85287

J. Nanotechnol. Eng. Med 1(2), 021010 (May 14, 2010) (4 pages) doi:10.1115/1.4001536 History: Received March 23, 2010; Revised March 30, 2010; Published May 14, 2010; Online May 14, 2010

This paper presents a novel structure for a neural sensor using a surface micromachining technique with dry-etch benzocyclobutene selected as the substrate and packaging material. The finished device has intracortical recording sites on both sides and epidural recording sites on the front. The design doubled the total channel number of recording sites compared with the conventional single-sided electrode structure. The developed process shows reliable, high fabrication yield, and preliminary fabrication and impedance test results suggest that this newly developed neural sensor could improve the performance and efficiency of neural recording.

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Copyright © 2010 by American Society of Mechanical Engineers
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Figures

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Figure 1

Schematic of a BCB-based neural sensor with (a) single conduction traces and (b) double-sided conduction traces

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Figure 2

Schematic top view of the BCB-based electrode with ten channels on the front side and eight channels on the back side

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Figure 3

Schematic view of the single unit-gain buffer

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Figure 4

Schematic view of the headstage circuits

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Figure 5

Structure layout of a BCB electrode

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Figure 6

Process flow of the double-sided BCB electrode

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Figure 7

Fabricated electrodes with double-sided conduction traces: (a) overview of the probe, (b) penetrating tip, (c) flexible cable and connection, (d) headstage with soldering pads for on-chip buffer, and (e) connection pads for microconnection to a zero insertion force (ZIF) connector

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Figure 8

Close view of the penetrating tip with double-sided intracortical recording sites (20×20 μm2) and epidural recording sites (60×60 μm2)

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Figure 9

On-chip buffer integration by flip chip bonding (FCB): (a) single chip bonding and (b) bonded headstage with three buffers

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Figure 10

BCB electrode impedance spectrum

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