Steadily increasing heat dissipation in electronic devices has generated renewed interest in direct immersion cooling. The ideal heat transfer fluid for direct immersion cooling applications should be chemically and thermally stable, and compatible with the electronic components. These constraints have led to the use of Novec fluids and fluroinerts as coolants. Although these fluids are chemically stable and have low dielectric constants, they are plagued by poor thermal properties like low thermal conductivity (about twice that of air) and low specific heat (same as that of air). These factors necessitate the development of new heat transfer fluids with improved heat transfer properties and applicability. C4H4F6O is a new heat transfer fluid which has been identified using computer-aided molecular design (CAMD) and knowledge-based approaches. A mixture of Novec fluid (HFE 7200) with C4H4F6O is evaluated in this study. Pool boiling experiments are performed at saturated condition on a 10 mm × 10 mm silicon test chip with CuO nanostructures on a microgrooved surface, to investigate the thermal performance of this new fluid mixture. The mixture increased the critical heat flux moderately by 8.4% over pure HFE 7200. Additional investigation is necessary before C4H4F6O can be considered for immersion cooling applications.