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Gen-3 Thermal Management Technology: Role of Microchannels and Nanostructures in an Embedded Cooling Paradigm

[+] Author and Article Information
Avram Bar-Cohen

Program Manager
Microsystems Technology Office,
Defense Advanced Research Projects Agency (DARPA),
675 North Randolph Street,
Arlington, VA 22203

Manuscript received October 24, 2012; final manuscript received January 22, 2013; published online July 23, 2013. Assoc. Editor: Debjyoti Banerjee.

J. Nanotechnol. Eng. Med 4(2), 020907 (Jul 23, 2013) (3 pages) Paper No: NANO-12-1130; doi: 10.1115/1.4023898 History: Received October 24, 2012; Revised January 22, 2013

The thermal management challenges facing electronic system developers and the need, as well as challenges, associated with the development of a Gen-3 embedded cooling paradigm are examined. We argue that the inherent limitations of the prevailing “remote cooling” technology have resulted in commercial and military electronic systems that are thermally-limited, performing well below the inherent electrical capability of the device technology they exploit. To overcome these limitations and remove a significant barrier to continued Moore's law progression in electronic components and systems, DARPA is pursuing the aggressive development of thermal management “embedded” in the chip, substrate, and/or package to directly cool the heat generation sites. The options and challenges associated with the development of this “Gen-3” thermal management technology are described.

Copyright © 2013 by ASME
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Bar-Cohen, A., and Bloschock, K., 2012, “Advanced Thermal Management Technologies for Defense Electronics,” Proceedings, SPIE Defense, Security and Sensing Conference, Baltimore, MD, April. [CrossRef]
Bar-Cohen, A., and Geisler, K. J. L., 2011, “Cooling the Electronic Brain,” Mech. Eng., 133(4), pp. 38–41.
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Bar-Cohen, A., Sheehan, J., and Rahim, E., 2012, “Two-Phase Thermal Transport in Microgap Channels-Theory, Experimental Results, and Predictive Relations,” Microgravity Sci. Technol., 24, pp. 1–15. [CrossRef]


Grahic Jump Location
Fig. 2

A cross-sectional conceptual schematic of an embedded cooling, Gen-3 (ICECool) device

Grahic Jump Location
Fig. 1

Schematic representation of the prevailing “remote cooling” thermal management paradigm




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