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Technical Brief

Molecule Dynamics Simulation of Heat Transfer Between Argon Flow and Parallel Copper Plates

[+] Author and Article Information
Yong Tang, Wei Yuan

Key Laboratory of Surface Functional Structure
Manufacturing of Guangdong High Education Institutes,
School of Mechanical and Automotive Engineering,
South China University of Technology,
Guangzhou 510640, China

Ting Fu

Key Laboratory of Surface Functional Structure
Manufacturing of Guangdong High Education Institutes,
School of Mechanical and Automotive Engineering,
South China University of Technology,
Guangzhou 510640, China
Department of Mechanical and Aerospace Engineering,
University of Missouri,
Columbia, MO 65211
e-mail: futing1234gh@163.com

Yijin Mao

Department of Mechanical and Aerospace Engineering,
University of Missouri,
Columbia, MO 65211

Yuwen Zhang

Department of Mechanical and Aerospace Engineering,
University of Missouri,
Columbia, MO 65211

1Corresponding author.

Manuscript received September 10, 2014; final manuscript received November 11, 2014; published online December 10, 2014. Assoc. Editor: Abraham Wang.

J. Nanotechnol. Eng. Med 5(3), 034501 (Aug 01, 2014) (4 pages) Paper No: NANO-14-1059; doi: 10.1115/1.4029158 History: Received September 10, 2014; Revised November 11, 2014; Online December 10, 2014

Molecular dynamics (MD) simulation aiming to investigate heat transfer between argon fluid flow and two parallel copper plates in the nanoscale is carried out by simultaneously control momentum and temperature of the simulation box. The top copper wall is kept at a constant velocity by adding an external force according to the velocity difference between on-the-fly and desired velocities. At the same time the top wall holds a higher temperature while the bottom wall is considered as physically stationary and has a lower temperature. A sample region is used in order to measure the heat flux flowing across the simulation box, and thus the heat transfer coefficient between the fluid and wall can be estimated through its definition. It is found that the heat transfer coefficient between argon fluid flow and copper plate in this scenario is lower but still in the same order magnitude in comparison with the one predicted based on the hypothesis in other reported work.

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Figures

Grahic Jump Location
Fig. 1

Computational configuration, liquid argon atoms are placed between bottom and top solid copper atoms

Grahic Jump Location
Fig. 2

Final velocity and temperature profiles distribution along with y axis

Grahic Jump Location
Fig. 3

Heat flux variation along with simulation time-step

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