This paper examines the performance of a silicon nozzle on the droplet impingement cooling of a simulated electronic chip with a dielectric coolant. A silicon nozzle plate with 49 orifices on a 1 inch square area is bonded with swirl chips. A compact test beds with embedded cartridge heaters and thermocouples at specified locations, is built and integrated with a condenser to test the cooling performance at a given heat flux. Through the system testing, the importance of vapor/excess-liquid exits, orientation due to gravity, and the temperature control of recirculating liquid are revealed. The use of Swiss-roll micronozzles have provided up to 45 W/cm2 uniform heat removal at 23 cc/min cm2 liquid flux.
Droplet Impingement Cooling for Electronics Using Silicon Nozzles
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Wu, C, & Yao, SC. "Droplet Impingement Cooling for Electronics Using Silicon Nozzles." Proceedings of the ASME 2003 Heat Transfer Summer Conference. Heat Transfer: Volume 3. Las Vegas, Nevada, USA. July 21–23, 2003. pp. 519-527. ASME. https://doi.org/10.1115/HT2003-47358
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