Open-cell box-lattice structures consisting of mutually orthogonal thermally conductive cylindrical ligaments can be configured to have wide ranging porosity, a large specific surface area and effective thermal conductivity in a particular direction together with specified structural characteristics. Thermal and mechanical properties can be tuned (and anisotropy introduced) by specification of different filament diameter and pitch for the vertical and horizontal filaments. Analytical models for porosity, specific surface area and effective thermal conductivity of lattice structures having different ligament diameters and pitches (anisotropy) are developed. The models show that all three of these quantities are functions of three dimensionless lengths. This paper was also originally published as part of the Proceedings of the ASME 2005 Heat Transfer Summer Conference.
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ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference
July 17–22, 2005
San Francisco, California, USA
Conference Sponsors:
- Heat Transfer Division and Electronic and Photonic Packaging Division
ISBN:
0-7918-4200-2
PROCEEDINGS PAPER
Porosity, Specific Surface Area and Effective Thermal Conductivity of Anisotropic Open Cell Lattice Structures
Kiran Balantrapu,
Kiran Balantrapu
University of Nevada at Reno, Reno, NV
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Deepti Rao Sarde,
Deepti Rao Sarde
University of Nevada at Reno, Reno, NV
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Christopher M. Herald,
Christopher M. Herald
University of Nevada at Reno, Reno, NV
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Richard A. Wirtz
Richard A. Wirtz
University of Nevada at Reno, Reno, NV
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Kiran Balantrapu
University of Nevada at Reno, Reno, NV
Deepti Rao Sarde
University of Nevada at Reno, Reno, NV
Christopher M. Herald
University of Nevada at Reno, Reno, NV
Richard A. Wirtz
University of Nevada at Reno, Reno, NV
Paper No:
IPACK2005-73191, pp. 267-275; 9 pages
Published Online:
March 4, 2009
Citation
Balantrapu, K, Sarde, DR, Herald, CM, & Wirtz, RA. "Porosity, Specific Surface Area and Effective Thermal Conductivity of Anisotropic Open Cell Lattice Structures." Proceedings of the ASME 2005 Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems collocated with the ASME 2005 Heat Transfer Summer Conference. Advances in Electronic Packaging, Parts A, B, and C. San Francisco, California, USA. July 17–22, 2005. pp. 267-275. ASME. https://doi.org/10.1115/IPACK2005-73191
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