Research Papers

Pool Boiling of HFE 7200–C4H4F6O Mixture on Hybrid Micro-Nanostructured Surface

[+] Author and Article Information
Aravind Sathyanarayana, Yogendra Joshi

G. W. Woodruff School of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332-0405

Pramod Warrier, Amyn S. Teja

School of Chemical & Biomolecular Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332-0100

Yunhyeok Im

Samsung Electronics Co.,
Banwol-dong, Hwaseong-si,
Gyeonggi-do 445-701, Republic of Korea

Manuscript received May 28, 2012; final manuscript received October 23, 2012; published online March 26, 2013. Assoc. Editor: Debjyoti Banerjee.

J. Nanotechnol. Eng. Med 3(4), 041004 (Mar 26, 2013) (7 pages) doi:10.1115/1.4023245 History: Received May 28, 2012; Revised October 23, 2012

Steadily increasing heat dissipation in electronic devices has generated renewed interest in direct immersion cooling. The ideal heat transfer fluid for direct immersion cooling applications should be chemically and thermally stable, and compatible with the electronic components. These constraints have led to the use of Novec fluids and fluroinerts as coolants. Although these fluids are chemically stable and have low dielectric constants, they are plagued by poor thermal properties like low thermal conductivity (about twice that of air) and low specific heat (same as that of air). These factors necessitate the development of new heat transfer fluids with improved heat transfer properties and applicability. C4H4F6O is a new heat transfer fluid which has been identified using computer-aided molecular design (CAMD) and knowledge-based approaches. A mixture of Novec fluid (HFE 7200) with C4H4F6O is evaluated in this study. Pool boiling experiments are performed at saturated condition on a 10 mm × 10 mm silicon test chip with CuO nanostructures on a microgrooved surface, to investigate the thermal performance of this new fluid mixture. The mixture increased the critical heat flux moderately by 8.4% over pure HFE 7200. Additional investigation is necessary before C4H4F6O can be considered for immersion cooling applications.

Copyright © 2013 by ASME
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Fig. 1

Schematic of the test chip package

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Fig. 2

Test chip fabrication process

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Fig. 4

SEM images of (a) microgrooved surface, (b) CuO nanostructures on microgrooved surface

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Fig. 5

Temperature–resistance calibration curve for Pt RTD

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Fig. 6

Schematic of pool boiling experimental setup

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Fig. 7

VLE curve for mixture of C4H4F6O–HFE 7200

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Fig. 8

Instantaneous droplet shape of (a) pure HFE 7200, (b) pure C4H4F6O, and (c) water, on a bare chip

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Fig. 9

Pool boiling curve for pure HFE 7200 at saturated condition on CuO nanostructured surface

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Fig. 10

Pool boiling curve for 10 wt. % mixture of C4H4F6O–HFE 7200 at saturated condition on CuO nanostructured surface

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Fig. 11

Heat transfer coefficient curves for pure HFE 7200 and 10 wt. % mixture of C4H4F6O–HFE 7200 at saturated condition

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Fig. 12

Predicted CHF values for different weight fractions of C4H4F6O on an infinite heater and a small heater



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