In the literature, the local-global finite element analysis technique plays a very important role in the area array packaging. In this study, the underlying goal is to propose an improved equivalent model for the use in the local/global analysis, and most importantly, provide a systematic procedure in approaching this equivalent model. In addition, the choice of the equivalent beam model will also be extensively investigated. Since the configuration of the solder joint is far from being close to a “beam-like” structure, defining the corresponding equivalent beam involves great levels of difficulties. In order to remove the possible difficulties, an effective way is proposed: incorporating analytical derivations and optimization. To this end, one practical application is presented to substantiate the proposed methodology.

Issue Section:
Special Section Technical Papers
Topics:
Ball-Grid-Array packaging, Finite element analysis, Optimization, Packaging, Solder joints
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