This paper will discuss the design of semiconductor packages having integrated air cooled heatsinks for use in high power electronic systems. It will demonstrate how simple models of the heat transfer from the heatsink fins, which are based on empirical correlations, may be utilized in combination with either simple analytical models or two-dimensional finite difference (FD) models of the heat conduction from the semiconductor die through the multilayer package structure to the base of the fins. These models allow the rapid evaluation of performance under both steady-state and transient overload conditions, and can be used to rapidly explore a wide range of design options before selecting candidate layouts for more detailed evaluation using 3D analysis tools. Wind tunnel experiments, which will also be reported, have been carried out to verify the modeling results for different semiconductor device layouts. These trials demonstrate excellent agreement between the models and experimental results.
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December 2001
Special Section On Therminic
IGBT Package Design for High Power Aircraft Electronic Systems
Farhad Sarvar,
Farhad Sarvar
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom
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David C. Whalley,
David C. Whalley
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom
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Ming K. Low
Ming K. Low
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom
Search for other works by this author on:
Farhad Sarvar
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom
David C. Whalley
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom
Ming K. Low
Wolfson School of Mechanical and Manufacturing Engineering, Loughborough University, Loughborough, Leics, LE11 3TU, United Kingdom
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD September 3, 2001. Associate Editor: B. Courtois
J. Electron. Packag. Dec 2001, 123(4): 338-343 (6 pages)
Published Online: September 3, 2001
Article history
Received:
September 3, 2001
Citation
Sarvar , F., Whalley , D. C., and Low, M. K. (September 3, 2001). "IGBT Package Design for High Power Aircraft Electronic Systems ." ASME. J. Electron. Packag. December 2001; 123(4): 338–343. https://doi.org/10.1115/1.1390341
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