In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies are investigated by Taguchi method. The orthogonal arrays of is applied to examine the shear strain effects of solder joints under five temperature loading parameters of the temperature ramp rate, the high and low temperature dwells, and the dwell time of both high and low temperatures by means of three simulated analyses of creep, plastic, and plastic-creep behavior on the WLCSP assemblies. It is found that the temperature dwell is the most significant factor on the effects of shear strain range from these analyses. The effect of high temperature dwell on the shear strain range is larger than that of low temperature dwell in creep analysis, while the effect of high temperature dwell on the shear strain range is smaller than that of low temperature dwell in both plastic and plastic-creep analyses.
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e-mail: wenren@cycu.edu.tw
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March 2008
Research Papers
The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
Wen-Ren Jong,
Wen-Ren Jong
Professor
Department of Mechanical Engineering,
e-mail: wenren@cycu.edu.tw
Chung Yuan Christian University
, Chung-Li, Taiwan; R&D Center for Mold and Molding Technology, Chung-Yuan Christian University
, Chung-Li, Taiwan
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Hsin-Chun Tsai,
Hsin-Chun Tsai
Department of Mechanical Engineering,
Minghsin University of Science and Technology
, Hsin-Chu, Taiwan
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Hsiu-Tao Chang,
Hsiu-Tao Chang
Department of Mechanical Engineering,
Chung Yuan Christian University
, Chung-Li, Taiwan
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Shu-Hui Peng
Shu-Hui Peng
Department of Mechanical Engineering,
Chung Yuan Christian University
, Chung-Li, Taiwan
Search for other works by this author on:
Wen-Ren Jong
Professor
Department of Mechanical Engineering,
Chung Yuan Christian University
, Chung-Li, Taiwan; R&D Center for Mold and Molding Technology, Chung-Yuan Christian University
, Chung-Li, Taiwane-mail: wenren@cycu.edu.tw
Hsin-Chun Tsai
Department of Mechanical Engineering,
Minghsin University of Science and Technology
, Hsin-Chu, Taiwan
Hsiu-Tao Chang
Department of Mechanical Engineering,
Chung Yuan Christian University
, Chung-Li, Taiwan
Shu-Hui Peng
Department of Mechanical Engineering,
Chung Yuan Christian University
, Chung-Li, TaiwanJ. Electron. Packag. Mar 2008, 130(1): 011001 (10 pages)
Published Online: January 31, 2008
Article history
Received:
December 13, 2005
Revised:
August 21, 2007
Published:
January 31, 2008
Citation
Jong, W., Tsai, H., Chang, H., and Peng, S. (January 31, 2008). "The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method." ASME. J. Electron. Packag. March 2008; 130(1): 011001. https://doi.org/10.1115/1.2837508
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