The current density distribution in a line-to-bump structure as a function of cross-sectional area ratio of the electrical conductor was investigated, as well as the effects of current crowding on electromigration and interfacial reaction in lead-free solder joints. Finite element analysis shows that the crowding factor is directly proportional to the cross-sectional area ratio between Cu line and contact opening at the cathode side. solder joints with Cu line in different widths were designed and tested under at for . The experiment results show that big voids induced by electromigration are only formed at the structure with a narrower line. Moreover, the growth of intermetallic compound layers, as well as dissolution of Cu at the cathode side, is accelerated by smaller current crowding, whereas impeded by a bigger one.
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e-mail: shweld@sjtu.edu.cn
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September 2008
Research Papers
Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints
Hao Lu,
Hao Lu
School of Materials Science and Engineering,
e-mail: shweld@sjtu.edu.cn
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.
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Chun Yu,
Chun Yu
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.
Search for other works by this author on:
Peilin Li,
Peilin Li
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.
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Junmei Chen
Junmei Chen
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.
Search for other works by this author on:
Hao Lu
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.e-mail: shweld@sjtu.edu.cn
Chun Yu
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.
Peilin Li
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.
Junmei Chen
School of Materials Science and Engineering,
Shanghai Jiaotong University
, Shanghai 200030, P.R.C.J. Electron. Packag. Sep 2008, 130(3): 031008 (5 pages)
Published Online: August 1, 2008
Article history
Received:
June 4, 2007
Revised:
December 3, 2007
Published:
August 1, 2008
Citation
Lu, H., Yu, C., Li, P., and Chen, J. (August 1, 2008). "Current Crowding and its Effects on Electromigration and Interfacial Reaction in Lead-Free Solder Joints." ASME. J. Electron. Packag. September 2008; 130(3): 031008. https://doi.org/10.1115/1.2957322
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