This study develops a novel glass cover chip (GCC) technique for the packaging of CMOS image sensors (CIS), in which the glass cover plate is attached directly to the chip using a nonconductive adhesive film. Taking the adhesive force between the glass plate and the chip as a performance indicator, a series of Taguchi trials are performed to establish the optimal GCC processing conditions. The experimental results confirm the feasibility of the proposed packaging technique and indicate a volume reduction of 59.47% compared with the traditional CIS package. Furthermore, the simulation results reveal that the heat dissipation efficiency of the proposed CIS package exceeds that of the traditional package by 245%.

Issue Section:
Research Papers
Keywords:
CMOS image sensors, integrated circuit packaging, microfabrication, microsensors, Taguchi methods, glass cover chip, CMOS image sensor, Taguchi method, packaging process
Topics:
Adhesives, Complementary metal oxide semiconductors, Energy dissipation, Glass, Packaging, Sensors, Taguchi methods, Temperature, Bonding, Heat, Manufacturing
1.
Yoon
,
K.
,
Kim
,
C.
,
Lee
,
B.
, and
Lee
,
D.
, 2002, “
Sing-Chip CMOS Image Sensor for Mobile Applications
,”
IEEE J. Solid-State Circuits
0018-9200,
37
(
12
), pp.
1839
–
1845
.
Crossref
Search ADS
 
2.
Abdallah
,
S.
,
Saleh
,
B.
, and
Aboulsoud
,
A. K.
, 2002, “
A General Overview of Solid State Imaging Sensors Types
,”
Third Workshop on Photonics and Its Application at Egyptian Engineering Faculties and Institutes
, Jan. 5, pp.
1
–
10
.
3.
Carlson
,
B. S.
, 2002, “
Comparison of Modern CCD and CMOS Image Sensor Technologies and Systems for Low Resolution Imaging
,”
IEEE Sens. J.
1530-437X,
1
, pp.
171
–
176
.
4.
Chowdhury
,
A.
,
Darveaux
,
R.
,
Tome
,
J.
,
Schoonejongen
,
R.
,
Reifel
,
M.
,
Guzman
,
A. D.
,
Park
,
S. S.
,
Kim
,
Y. W.
, and
Kim
,
H. W.
, 2005, “
Challenges of Megapixel Camera Module Assembly and Test
,”
Proceeding of IEEE Electronic Components and Technology Conference
, May 31, Vol.
2
, pp.
1390
–
1401
.
5.
Segawa
,
M.
,
Ono
,
M.
,
Musha
,
S.
,
Kishimoto
,
Y.
, and
Ohashi
,
A.
, 1999, “
A CMOS Image Sensor Module Applied for a Digital Still Camera Utilizing the TAB on Glass (TOG) Bonding Method
,”
IEEE Trans. Adv. Packag.
1521-3323,
22
, pp.
160
–
165
.
Crossref
Search ADS
 
6.
Steiner
,
R.
,
Schneider
,
M.
,
Mayer
,
F.
,
Munch
,
U.
,
Mayer
,
T.
, and
Baltes
,
H.
, 1998, “
Fully Packaged CMOS Current Monitor Using Lead-on-Chip Technology
,”
Proceeding of IEEE Eleventh Annual International Workshop on MEMS
, Jan. 25–29, pp.
603
–
608
.
7.
Sengupta
,
K.
,
Sundahl
,
R.
,
Kawashima
,
S.
,
Arellano
,
R.
,
Sklenicka
,
C.
, and
Thompson
,
D.
, 1998, “
Packaging Requirements and Solutions for CMOS Imaging Sensors
,”
Proceedings of IEEE/CPMI International Electronics Manufacturing Technology Symposium
, Oct. 19–21, pp.
194
–
198
.
8.
Okada
,
Y.
,
Katahira
,
T.
,
Masuda
,
N.
,
Koseki
,
T.
, and
Takai
,
T.
, 2001, “
Material Characterization and In-Situ Process Monitoring for a Robust ACF Base Flip Chip Technology
,”
IEEE Trans. Compon. Packag. Technol.
1521-3331,
24
, pp.
713
–
720
.
Crossref
Search ADS
 
9.
Karasawa
,
J.
,
Segawa
,
M.
,
Kishimoto
,
Y.
,
Aoki
,
M.
, and
Sasaki
,
T.
, 2001, “
Flip Chip Interconnection Method Applied to Small Camera Module
,”
Proceedings of IEEE Electronic Components and Technology Conference
, May 29–Jun. 1, pp.
1024
–
1028
.
10.
Pajonk
,
J.
, 2004, “
New Flip Chip Technology Utilizing Non-Conductive Adhesive Adapted for High Volume Chip Card Module Production
,”
Proceedings of IEEE/CPMI/SEMI Electronics Manufacturing Technology Symposium
, Jul. 14–16, pp.
165
–
170
.
11.
Li
,
Y.
,
Xie
,
J.
,
Verma
,
T.
, and
Wang
,
V.
, 2001, “
Reliability Study of High-Pin-Count Flip-Chip BGA
,”
Proceedings of the 51st Electronic Components and Technology Conference
,
Altera Corp.
,
San Jose, CA
, pp.
276
–
280
.
12.
1992, “
High Pin Count Package for Semiconductor Device
,” U.S. Patent No. 5,468,994.
13.
ChipMos Technologies Inc.
, 2006, “
Image Sensor Package and Method Manufacturing the Same
,” Patent No. I,248,665.
14.
El Gamal
,
A.
, and
Eltoukhy
,
H.
, 2005, “
CMOS Image Sensors
,”
IEEE Circuits Devices Mag.
8755-3996,
21
(
3
), pp.
6
–
20
.
Crossref
Search ADS
 
17.
Hedayat
,
A. S.
,
Sloane
,
N. J. A.
, and
Stufken
,
J.
, 1999,
Orthogonal Arrays: Theory and Applications
,
Springer
,
New York
.
18.
Fowlkes
,
W. Y.
, and
Creveling
,
C. M.
, 1995,
Engineering Methods for Robust Product Design: Using Taguchi Methods in Technology and Product Development
,
Addison-Wesley
,
Reading, MA
.
19.
Taguchi
,
G.
, 1986,
Introduction to Quality Engineering
,
Asian Productivity Organization
,
Tokyo
.
20.
Park
,
S. H.
, 1996,
Robust Design and Analysis for Quality Engineering
,
Chapman & Hall
,
London
.
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