New nondestructive inspection methods with high spatial resolution are expected to support the evaluation and enhancement of the reliability of microjoints on printed circuit boards. An X-ray microtomography system, the SP-μCT has been developed at the Super Photon ring-8 GeV (SPring-8), the largest synchrotron radiation facility in Japan. In this work, the SP-μCT was first applied to the nondestructive evaluation of thermal fatigue phenomena, namely microstructure evolution (i.e., phase growth) and microcrack propagation, appearing in actual solder microbumps of flip chip interconnects due to thermal cyclic loading. In addition, a refraction-contrast imaging technique was simultaneously applied to visualize the fatigue cracks with an actual opening of less than 100 nm. The observed specimen has a flip chip structure joined by Sn-37wt%Pb eutectic solder bumps 150 μm in diameter. Consequently, the process of phase growth and crack propagation was determined via observation of consecutive computed tomography (CT) images obtained in the same plane of the same specimen. As the thermal cycle proceeded, remarkable phase growth was clearly observed, followed by the appearance of fatigue cracks in the corners of the interfaces between the solder bump and Cu pad. Moreover, the CT images also enabled us to evaluate the fatigue lifetime of the bumps, as follows. The lifetime to fatigue crack initiation was estimated by quantifying the increase in the phase growth. The crack propagation lifetime to failure was then determined by measuring the average crack propagation rate. Such results have not been obtainable at all by X-ray CT systems for industrial use and demonstrate the possibility of nondestructive inspection by a synchrotron radiation X-ray microtomography system.
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e-mail: turitani@itc.pref.toyama.jp
e-mail: sayama@itc.pref.toyama.jp
e-mail: okamotoyoshiyuki@cosel.co.jp
e-mail: takayanagi@cosel.co.jp
e-mail: ueken@spring8.or.jp
e-mail: tmori@pu-toyama.ac.jp
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June 2011
Research Papers
Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
Hiroyuki Tsuritani,
e-mail: turitani@itc.pref.toyama.jp
Hiroyuki Tsuritani
Machinery and Electronics Research Institute
, Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 930-0866, Japan
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Toshihiko Sayama,
e-mail: sayama@itc.pref.toyama.jp
Toshihiko Sayama
Machinery and Electronics Research Institute
, Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 930-0866, Japan
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Yoshiyuki Okamoto,
e-mail: okamotoyoshiyuki@cosel.co.jp
Yoshiyuki Okamoto
On-Board Standard Design Department, Cosel Co., Ltd.
, 1-6-43 Kamiakae-machi, Toyama-shi, Toyama 930-0816, Japan
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Takeshi Takayanagi,
e-mail: takayanagi@cosel.co.jp
Takeshi Takayanagi
On-Board Standard Design Department, Cosel Co., Ltd.
, 1-6-43 Kamiakae-machi, Toyama-shi, Toyama 930-0816, Japan
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Kentaro Uesugi,
Kentaro Uesugi
SPring-8,
e-mail: ueken@spring8.or.jp
Japan Synchrotron Radiation Research Institute (JASRI)
, 1-1-1 Koto, Sayo-cho, Sayo-gun, Hyogo 679-5198, Japan
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Takao Mori
Takao Mori
Department of Mechanical System Engineering,
e-mail: tmori@pu-toyama.ac.jp
Toyama Prefectural University
, 5180 Kurokawa, Imizu-shi, Toyama 939-0398, Japan
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Hiroyuki Tsuritani
Machinery and Electronics Research Institute
, Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 930-0866, Japan
e-mail: turitani@itc.pref.toyama.jp
Toshihiko Sayama
Machinery and Electronics Research Institute
, Toyama Industrial Technology Center, 383 Takata, Toyama-shi, Toyama 930-0866, Japan
e-mail: sayama@itc.pref.toyama.jp
Yoshiyuki Okamoto
On-Board Standard Design Department, Cosel Co., Ltd.
, 1-6-43 Kamiakae-machi, Toyama-shi, Toyama 930-0816, Japan
e-mail: okamotoyoshiyuki@cosel.co.jp
Takeshi Takayanagi
On-Board Standard Design Department, Cosel Co., Ltd.
, 1-6-43 Kamiakae-machi, Toyama-shi, Toyama 930-0816, Japan
e-mail: takayanagi@cosel.co.jp
Kentaro Uesugi
SPring-8,
Japan Synchrotron Radiation Research Institute (JASRI)
, 1-1-1 Koto, Sayo-cho, Sayo-gun, Hyogo 679-5198, Japan
e-mail: ueken@spring8.or.jp
Takao Mori
Department of Mechanical System Engineering,
Toyama Prefectural University
, 5180 Kurokawa, Imizu-shi, Toyama 939-0398, Japan
e-mail: tmori@pu-toyama.ac.jp
J. Electron. Packag. Jun 2011, 133(2): 021007 (9 pages)
Published Online: June 23, 2011
Article history
Received:
August 11, 2010
Revised:
March 26, 2011
Online:
June 23, 2011
Published:
June 23, 2011
Citation
Tsuritani, H., Sayama, T., Okamoto, Y., Takayanagi, T., Uesugi, K., and Mori, T. (June 23, 2011). "Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects." ASME. J. Electron. Packag. June 2011; 133(2): 021007. https://doi.org/10.1115/1.4003992
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