Electromigration (EM) in solder joints under high current density has become a critical reliability issue for the future high density microelectronic packaging. This paper presents atomic density redistribution algorithm for predicting electromigration induced void nucleation and growth in solder joints of Chip Scale Package (CSP) structure. The driving force for electromigration induced failure considered here includes the electron wind force, stress gradients, temperature gradients, as well as the atomic density gradient, which were neglected in many of the existing studies on electromigration. The simulation results for void generation and time to failure (TTF) are discussed and correlated with the previous test results. EM sensitivity analysis is also performed to investigate the effect of EM parameters and mechanical properties of material on electromigration failure. The simulation results indicated that the atomic density on the activation energy is quite sensitive, and the mechanical material parameters have no impact on EM sensitivity of normalized atomic density.
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e-mail: lianglihua@zjut.edu.cn
e-mail: jarson_zhang@hotmail.com
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September 2011
Research Papers
Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis
Lihua Liang,
Lihua Liang
College of Mechanical Engineering,
e-mail: lianglihua@zjut.edu.cn
Zhejiang University of Technology
, Hangzhou 310014, P. R. China
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Yuanxiang Zhang,
Yuanxiang Zhang
College of Mechanical Engineering,
e-mail: jarson_zhang@hotmail.com
Zhejiang University of Technology
, Hangzhou 310014, P. R. China
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Yong Liu
Yong Liu
Search for other works by this author on:
Lihua Liang
College of Mechanical Engineering,
Zhejiang University of Technology
, Hangzhou 310014, P. R. China
e-mail: lianglihua@zjut.edu.cn
Yuanxiang Zhang
College of Mechanical Engineering,
Zhejiang University of Technology
, Hangzhou 310014, P. R. China
e-mail: jarson_zhang@hotmail.com
Yong Liu
J. Electron. Packag. Sep 2011, 133(3): 031002 (12 pages)
Published Online: September 14, 2011
Article history
Received:
July 14, 2010
Revised:
May 30, 2011
Online:
September 14, 2011
Published:
September 14, 2011
Citation
Liang, L., Zhang, Y., and Liu, Y. (September 14, 2011). "Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis." ASME. J. Electron. Packag. September 2011; 133(3): 031002. https://doi.org/10.1115/1.4004658
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