In this study, a lead-free dummy plastic ball grid array component with daisy-chains and Sn4.0Ag0.5Cu Pb-free solder balls was assembled on an halogen-free high density interconnection printed circuit board (PCB) by using Sn1.0Ag0.5Cu solder paste on the Cu pad surfaces of either organic solderable preservative (OSP) or electroless nickel immersion gold (ENIG). The assembly was tested for the effect of the formation extent of Ag3Sn intermetallic compound. Afterward a board-level pulse-controlled drop test was conducted on the as-reflowed assemblies according to the JESD22-B110 and JESD22-B111 standards, the impact performance of various surface finished halogen-free printed circuit board assembly was evaluated. The test results showed that most of the fractures occurred around the pad on the test board first. Then cracks propagated across the outer build-up layer. Finally, the inner copper trace was fractured due to the propagated cracks, resulting in the failure of the PCB side. Interfacial stresses numerically obtained by the transient stress responses supported the test observation as the simulated initial crack position was the same as that observed.
Issue Section:
Research Papers
Topics:
Failure,
Failure analysis,
Fracture (Materials),
Intermetallic compounds,
Lead-free solders,
Printed circuit board assemblies,
Solder joints,
Solders,
Stress,
Tin,
Copper,
Fracture (Process),
Corners (Structural elements),
Ball-Grid-Array packaging,
Density,
Transients (Dynamics),
Alloys,
Brittleness,
Chain
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.Copyright © 2012
by American Society of Mechanical Engineers
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