A sensor is developed for simple, in situ characterization of dielectric thermal interface materials (TIMs) at bond line thicknesses less than 100 μm. The working principle is based on the detection of regions of contrasting electric permittivity. An array of long, parallel electrodes is flush-mounted into each opposing substrate face of a narrow gap interface, and exposed to the gap formed between the two surfaces. Electrodes are oriented such that their lengthwise dimension in one substrate runs perpendicular to those in the other. A capacitance measurement taken between opposing electrodes is used to characterize the interface region in the vicinity of their crossing point (junction). The electric field associated with each electrode junction is numerically simulated and analyzed. Criteria are developed for the design of electrode junction geometries that localize the electric fields. The capacitances between floating-ground electrodes in the electrode sensor configuration employed give rise to a nontrivial network of interacting capacitances which strongly influence the measured response at any junction. A generalized solution for analyzing the floating network response is presented. The technique is used to experimentally detect thermal grease spots of 0.2 mm to 1.8 mm diameter within a 25 μm interface gap. It is necessary to use the generalized solution to the capacitance network developed in this work to properly delineate regions of contrasting permittivity in the interface gap region using capacitance measurements.
Skip Nav Destination
Article navigation
December 2014
Research-Article
Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes
Stephen H. Taylor,
Stephen H. Taylor
Cooling Technologies Research Center,
An NSF I/UCRC,
School of Mechanical Engineering,
An NSF I/UCRC,
School of Mechanical Engineering,
Purdue University
,West Lafayette, IN 47907
Search for other works by this author on:
Suresh V. Garimella
Suresh V. Garimella
1
Cooling Technologies Research Center,
An NSF I/UCRC,
School of Mechanical Engineering,
e-mail: sureshg@purdue.edu
An NSF I/UCRC,
School of Mechanical Engineering,
Purdue University
,West Lafayette, IN 47907
e-mail: sureshg@purdue.edu
1Corresponding author.
Search for other works by this author on:
Stephen H. Taylor
Cooling Technologies Research Center,
An NSF I/UCRC,
School of Mechanical Engineering,
An NSF I/UCRC,
School of Mechanical Engineering,
Purdue University
,West Lafayette, IN 47907
Suresh V. Garimella
Cooling Technologies Research Center,
An NSF I/UCRC,
School of Mechanical Engineering,
e-mail: sureshg@purdue.edu
An NSF I/UCRC,
School of Mechanical Engineering,
Purdue University
,West Lafayette, IN 47907
e-mail: sureshg@purdue.edu
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received October 6, 2013; final manuscript received July 18, 2014; published online September 19, 2014. Assoc. Editor: Ashish Gupta.
J. Electron. Packag. Dec 2014, 136(4): 041007 (11 pages)
Published Online: September 19, 2014
Article history
Received:
October 6, 2013
Revision Received:
July 18, 2014
Citation
Taylor, S. H., and Garimella, S. V. (September 19, 2014). "Void Detection in Dielectric Films Using a Floating Network of Substrate-Embedded Electrodes." ASME. J. Electron. Packag. December 2014; 136(4): 041007. https://doi.org/10.1115/1.4028075
Download citation file:
Get Email Alerts
Cited By
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
Effects of Spherical Targets on Capacitive Displacement Measurements
J. Manuf. Sci. Eng (November,2004)
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
J. Electron. Packag (June,2023)
Modeling-Simulation and Analysis of MEMS Capacitive Millibar Pressure Sensor
J. Nanotechnol. Eng. Med (November,2010)
A Capacitance Sensor for Two-Phase Liquid Film Thickness Measurements in a Square Duct
J. Fluids Eng (March,1997)
Related Proceedings Papers
Related Chapters
Spice Model on High Frequency Vibration for CMUT Application
International Conference on Mechanical and Electrical Technology, 3rd, (ICMET-China 2011), Volumes 1–3
New Faulty Line Selection Technology Cooperated with Style and Control of Petersen Coils
International Conference on Instrumentation, Measurement, Circuits and Systems (ICIMCS 2011)
Analysis for the Influence of Inductance Value on DCM Boost Converter
International Conference on Electronics, Information and Communication Engineering (EICE 2012)