Three-dimensional (3D) through-silicon-via (TSV) technology is emerging as a powerful technology to reduce package footprint, decrease interconnection power, higher frequencies, and provide efficient integration of heterogeneous devices. TSVs provide high speed signal propagation due to reduced interconnect lengths as compared to wire-bonding. The current flowing through the TSVs results in localized heat generation (joule heating), which could be detrimental to the device performance. The effect of joule heating on performance measured by transconductance, electron mobility (e− mobility), and channel thermal noise is presented. Results indicate that joule heating has a significant effect on the junction temperature and subsequently results in 10–15% performance hit.
Issue Section:
Research Papers
References
1.
Tummala
, R.
, 2001
, Fundamentals of Micro-Systems Packaging
, McGraw-Hill
, New York
.2.
i-Micronews, 2014, Yole Développement, Lyon, France, www.i-micronews.com
3.
Zheng
, J.
, Zhang
, Z.
, Chen
, Y.
, and Shi
, J.
, 2009
, “3D Stacked Package Technology and Its Application Prospects
,” International Conference on New Trends in Information and Service Sciences
, Beijing, China
, June 30–July 2, pp. 528
–533
.4.
Alam
, S. M.
, Jones
, R. E.
, Pozder
, S.
, Chatterjee
, R.
, and Jain
, A.
, 2010
, “Interstratum Connection Design Considerations for Cost Effective Three-Dimensional (3D) System Integration
,” IEEE Trans. VLSI Syst.
, 18
(3), pp. 450
–460
.10.1109/TVLSI.2008.20119105.
Applied Materials, 2010, “
Through-Silicon Via 3D Integration
,” Applied Materials Silicon Systems Group, Santa Clara, CA, http://www.appliedmaterials.com/sites/default/files/Applied_TSV_Primer.pdf6.
Sung
, B.
, Chepuri
, K. T.
, Yongje
, L.
, Agonafer
, D.
, Agonafer
, D.
, and Cristina
, A.
, 2006
, “Thermal Enhancement of Stacked Dies Using Thermal Vias
,” ASME International Mechanical Engineering Congress and Exposition
, Chicago, IL
, Nov. 5–10, ASME
Paper No. IMECE2006-15352, pp. 287
–293
.10.1115/IMECE2006-153527.
Nagendrappa
, N.
, Okamoto
, N.
, and Barez
, F.
, 2010
, “Thermal Characterization of Fan in Package-on-Packages
,” 26th Annual IEEE Semiconductor Thermal Measurement Symposium (SEMI-THERM 2010
), Santa Clara, CA
, Feb. 21–25, pp. 41
–46
.10.1109/STHERM.2010.54443178.
Matsumoto
, K.
, Ibaraki
, S.
, Sakuma
, K.
, Orii
, Y.
, and Yamada
, F.
, 2010
, “Investigation of Cooling Solutions for Three-Dimensional (3D) Chip Stacks
,” 26th Annual IEEE Semiconductor Thermal Measurement Symposium (SEMI-THERM 2010
), Santa Clara, CA
, Feb. 21–25, pp. 25
–32
.10.1109/STHERM.2010.54443199.
Kota
, K.
, Hidalgo
, P.
, Joshi
, Y.
, and Glezer
, A.
, 2010
, “A Novel Conduction–Convection Based Cooling Solution for 3D Stacked Electronics
,” 26th Annual IEEE Semiconductor Thermal Measurement Symposium
(SEMI-THERM 2010
), Santa Clara, CA, Feb. 21–25, pp. 33
–40
.10.1109/STHERM.2010.544431610.
Phan
, H. N.
, and Agonafer
, D.
, 2010
, “Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing a Multidimensional Configured Thermoelectric
,” 26th Annual IEEE Semiconductor Thermal Measurement Symposium
(SEMI-THERM 2010
), Santa Clara, CA
, Feb. 21–25, pp. 55
–58
.10.1109/STHERM.2010.544431511.
Agonafer
, D.
, and Phann
, H. N.
, 2012
, “Multidimensional Heat Transfer System for Cooling Electronic Components
,” U.S. Patent No. US20120211204-A1.12.
Brunschwiler
, T.
, Michel
, B.
, Rothuizen
, H.
, Kloter
, U.
, Wunderle
, B.
, Oppermann
, H.
, and Reichl
, H.
, 2008, “Forced Convecticve Interlayer Cooling in Vertically Integrated Packages,” Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM 2008
), Orlando, FL, May 28–31, pp. 1114–1125.10.1109/ITHERM.2008.454438613.
Karajgikar
, S.
, Agonafer
, D.
, Ghose
, K.
, Sammakia
, B.
, and Amon
, C.
, 2010
, “Multi-Objective Optimization to Improve Both Thermal and Device Performance of a Nonuniformly Powered Micro-Architecture
,” ASME J. Electron. Packag.
, 132
(2
), p. 021008
.10.1115/1.400185214.
Van Zeghbroeck
, B. J.
, 2011
, “Carrier Transport,” Principles of Semiconductor Devices, self-published e-book, Chap. 2.8, accessed Aug. 12, 2014, http://ecee.colorado.edu/~bart/book/transpor.htm15.
Mirza
, F.
, Raman
, T.
, Iftakher
, A.
, Iqbal
, S.
, and Agonafer
, D.
, 2012
, “Parametric Thermal Analysis of TSVs in a 3-D Module Based on Interconnect Delay and Silicon Efficiency
,” 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2012
), San Diego, CA
, May 30–June 1, pp. 150
–156
.10.1109/ITHERM.2012.623142516.
Ku
, T.
, 2011
, “3D TSV Stacking IC Technologies, Challenges and Opportunities
,” 7th Annual AMD Technical Forum and Exhibition on Advanced Technology, Taipei, Taiwan, Oct. 5, available at ITRI website, accessed Aug. 12, 2014, http://sites.amd.com/us/Documents/TFE2011_026ITR.pdf17.
Menon
, A.
, Karajgikar
, S.
, and Agonafer
, D.
, 2009
, “Thermal Design Optimization of a Package on Package
,” 25th Annual IEEE
Semiconductor Thermal Measurement and Management Symposium (SEMI-THERM 2009
), San Jose, CA
, Mar. 15–19, pp. 329
–335
.10.1109/STHERM.2009.481078418.
Abe
, Y.
, Tamada
, A.
, Abe
, N.
, Tanaka
, F.
, and Fujuki
, T.
, 2006
, “High Thermally Conductive and High Reliability Under-Fill
,” High Density Microsystem Design and Packaging and Component Failure Analysis Conference
(HDP'06
), Shanghai, China
, June 27–28, pp. 179
–181
.10.1109/HDP.2006.170759019.
Mississippi State University, 2009,
“Analog IC Design
,” Course No. EE 8843, accessed on Aug. 12, 2014, http://www.coursehero.com/file/1710655/pp39-46/20.
Kaufmyn
, W.
, 2014, “How Does Temperature Affect the Conductivity of a Conductor?,” Materials Science for Engineers course syllabus, Course No. ENGN 45, accessed Aug. 12, 2014, http://fog.ccsf.cc.ca.us/~wkaufmyn/ENGN45/Course%20Handouts/15_ElectricalProps/05_TemperatureConductivityConductor.htmlCopyright © 2014 by ASME
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