The extrapolation and generalization of accelerated test results for lead free solder joints require the identification of a damage function that can be counted on to apply beyond the region of the test. Individual ball grid array (BGA) scale Sn3Ag0.5Cu (SAC305) solder joints were subjected to isothermal shear fatigue testing at room temperature and 65 °C. The resulting mechanical response degradation and crack behavior, including strain hardening, crack initiation, and propagation, were correlated with the inelastic work and effective stiffness derived from load–displacement hysteresis loops. Crack initiation was found to scale with the accumulated work, independently of cycling amplitude and strain rate. The subsequent damage rate varied slightly with amplitude.
Issue Section:
Research Papers
References
1.
Mattila
, T.
, 2005
, “Reliability of High–Density Lead–Free Solder Interconnections Under Thermal Cycling and Mechanical Shock Loading
,” Ph.D. dissertation, Helsinki University of Technology, Helsinki, Finland.2.
Mayyas
, A.
, Yin
, L.
, and Borgesen
, P.
, 2009
, “Recrystallization of Lead Free Solder Joints: Confounding The Interpretation of Accelerated Thermal Cycling Results?
,” ASME
Paper No. IMECE2009-12749.10.1115/IMECE2009-127493.
Mayyas
, A.
, Qasaimeh
, A.
, Borgesen
, P.
, and Meilunas
, M.
, 2014
, “Effects of Latent Damage of Recrystallization on Lead Free Solder Joints
,” Microelectron. Reliab.
, 54
(2
), pp. 447
–456
.10.1016/j.microrel.2013.10.0064.
Andersson
, C.
, Lai
, Z.
, Liu
, J.
, Jiang
, H.
, and Yu
, Y.
, 2005
, “Comparison of Isothermal Mechanical Fatigue Properties of Lead-Free Solder Joints and Bulk Solders
,” Mater. Sci. Eng.
, A394
(1
), pp. 20
–27
.10.1016/j.msea.2004.10.0435.
Zhao
, J.
, Mutoh
, Y.
, Miyashita
, Y.
, and Mannan
, S.
, 2002
, “Fatigue Crack-Growth Behavior of Sn–Ag–Cu and Sn–Ag–Cu–Bi Lead-Free Solders
,” J. Electron. Mater.
, 31
(8
), pp. 879
–886
.10.1007/s11664-002-0199-z6.
Mutoh
, Y.
, Zhao
, J.
, Miyashita
, Y.
, and Kanchanomai
, C.
, 2002
, “Fatigue Crack Growth Behaviour of Lead-Containing and Lead-Free Solders
,” Soldering Surf. Mount Technol.
, 14
(3
), pp. 37
–45
.10.1108/095409102104447197.
Kanchanomai
, C.
, Miyashita
, Y.
, Mutoh
, Y.
, and Mannan
, S. L.
, 2002
, “Low Cycle Fatigue and Fatigue Crack Growth Behaviour of Sn–Ag Eutectic Solder
,” Soldering Surf. Mount Technol.
, 14
(3
), pp. 30
–36
.10.1108/095409102104447008.
Kanchanomai
, C.
, and Mutoh
, Y.
, 2007
, “Fatigue Crack Initiation and Growth in Solder Alloys
,” Fatigue Fract. Eng. Mater. Struct.
, 30
(5
), pp. 443
–457
.10.1111/j.1460-2695.2006.01088.x9.
Kanchanomai
, C.
, Miyashita
, Y.
, and Mutoh
, Y.
, 2002
, “Low-Cycle Fatigue Behavior and Mechanisms of a Lead-Free Solder 96.5 Sn/3.5 Ag
,” J. Electronic Mater.
, 31
(2
), pp. 142
–151
.10.1007/s11664-002-0161-010.
Kanchanomai
, C.
, Miyashita
, Y.
, Mutoh
, Y.
, and Mannan
, S. L.
, 2003
, “Influence of Frequency on Low Cycle Fatigue Behavior of Pb-Free Solder 96.5 Sn–3.5 Ag
,” Mater. Sci. Eng.
, A345
(1
), pp. 90
–98
.10.1016/S0921-5093(02)00461-611.
Kanchanomai
, C.
, and Mutoh
, Y.
, 2004
, “Low-Cycle Fatigue Prediction Model for Pb-Free Solder 96.5 Sn-3.5 Ag
,” J. Electron. Mater.
, 33
(4
), pp. 329
–333
.10.1007/s11664-004-0139-112.
Pang
, J. H.
, Xiong
, B. S.
, and Low
, T. H.
, 2004
, “Low Cycle Fatigue Models for Lead-Free Solders
,” Thin Solid Films
, 462
, pp. 408
–412
.10.1016/j.tsf.2004.05.03713.
Shang
, J.
, Zeng
, Q.
, Zhang
, L.
, and Zhu
, Q.
, 2007
, “Mechanical Fatigue of Sn-Rich Pb-Free Solder Alloys
,” J. Mater. Sci.: Mater. Electron.
, 18
(1–3
), pp. 211
–227
.10.1007/s10854-006-9027-114.
Darveaux
, R.
, 2002
, “Effect of Simulation Methodology on Solder Joint Crack Growth Correlation and Fatigue Life Prediction
,” ASME J. Electron. Packag.
, 124
(3
), pp. 147
–154
.10.1115/1.141376415.
Letcher
, T.
, Shen
, M. H.
, Scott-Emuakpor
, O.
, George
, T.
, and Cross
, C.
, 2012
, “An Energy-Based Critical Fatigue Life Prediction Method for AL6061‐T6
,” Fatigue Fract. Eng. Mater. Struct.
, 35
(9
), pp. 861
–870
.10.1111/j.1460-2695.2011.01669.x16.
Tchankov
, D. S.
, and Vesselinov
, K. V.
, 1998
, “Fatigue Life Prediction Under Random Loading Using Total Hysteresis Energy
,” Int. J. Pressure Vessels Piping
, 75
(13
), pp. 955
–960
.10.1016/S0308-0161(98)00100-817.
Rasband
, W. S.
, 1997
, imagej, U. S. National Institutes of Health, Bethesda, MD, accessed Nov. 2014, http://imagej.nih.gov/ij/18.
Borgesen
, P.
, Bieler
, T.
, Lehman
, L. P.
, and Cotts
, E. J.
, 2007
, “Pb-Free Solder: New Materials Considerations for Microelectronics Processing
,” MRS Bull.
, 32
(04
), pp. 360
–365
.10.1557/mrs2007.23619.
Qasaimeh
, A.
, Jaradat
, Y.
, Wentlent
, L.
, Yang
, L.
, Yin
, L.
, Arfaei
, B.
, and Borgesen
, P.
, 2011
, “Recrystallization Behavior of Lead Free and Lead Containing Solder in Cycling
,” IEEE 61st Electronic Components and Technology Conference (ECTC
), Lake Buena Vista, FL, May 31–June 3, pp. 1775
–1781
.10.1109/ECTC.2011.589875320.
Rittel
, D.
, Kidane
, A. A.
, Alkhader
, M.
, Venkert
, A.
, Landau
, P.
, and Ravichandran
, G.
, 2012
, “On the Dynamically Stored Energy of Cold Work in Pure Single Crystal and Polycrystalline Copper
,” Acta Mater.
, 60
(9
), pp. 3719
–3728
.10.1016/j.actamat.2012.03.02921.
Hamasha
, S.
, Jaradat
, Y.
, Qasaimeh
, A.
, Obaidat
, M.
, and Borgesen
, P.
, 2014
, “Assessment of Solder Joint Fatigue Life Under Realistic Service Conditions
,” J. Electron. Mater.
, 43
(12
), pp. 4472
–4484
.10.1007/s11664-014-3436-322.
Hamasha
, S.
, Qasaimeh
, A.
, Jaradat
, Y.
, and Borgesen
, P.
, 2015
, “Correlation Between Solder Joint Fatigue Life and Accumulated Inelastic Energy Deposition (Work) in Isothermal Cycling
,” IEEE Trans. Compon., Packag. Manuf. Technol.
(submitted).Copyright © 2015 by ASME
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