https://orcid.org/0009-0003-6614-3805
Abstract
Electronic packaging is integral to safeguarding electronic devices while ensuring electrical connectivity and heat dissipation. This paper reviews electrically conductive adhesives (ECAs), focusing on two main types: isotropic conductive adhesives (ICAs) and anisotropic conductive adhesives (ACAs). ECAs offer advantages over traditional solders, including lower processing temperatures, environmental friendliness, and the ability to conform to flexible substrates. The paper explores the working mechanisms of ICAs and ACAs, highlighting their limitations and recent developments aimed at improvement. Key challenges for ICAs include low electrical conductivity and moisture absorption, while ACAs face limitations in fine-pitch applications and electric field-induced particle movement. Recent advancements discussed include the use of organic monolayers, nanofiber integration, magnetic self-assembly, low-temperature sintering of nanosilver particles, and copper nanoparticle fillers. These innovations hold promise for enhancing the electrical conductivity, mechanical strength, and reliability of ECAs. Finally, the paper explores applications of ECAs in die attach, flip-chip bonding, and chip-on-flex (COF) packaging, highlighting their potential for various electronic devices.
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