Volume 120 Issue 2 | J. Electron. Packag.

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Preface

Special Section on Manufacturing for the Electronics Industry

Anthony J. Rafanelli

J. Electron. Packag. June 1998, 120(2): 117. doi: https://doi.org/10.1115/1.2792587

View articletitled, Special Section on Manufacturing for the Electronics Industry

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Topics: Electronics , Manufacturing

Special Section Technical Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Y. Li, R. L. Mahajan

J. Electron. Packag. June 1998, 120(2): 118–122. doi: https://doi.org/10.1115/1.2792592

Abstract

View articletitled, CBGA Solder Fillet Shape Prediction and Design Optimization

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Topics: Design , Optimization , Shapes , Solders , Reliability , Fatigue life , Ball-Grid-Array packaging , Ceramics , Composite materials , Engineering simulation

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

J. Li, I. Kao, V. Prasad

J. Electron. Packag. June 1998, 120(2): 123–128. doi: https://doi.org/10.1115/1.2792595

Abstract

View articletitled, Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

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Topics: Modeling , Semiconductor wafers , Stress , Wire , Particulate matter , Cutting , Silicon , Abrasives , Fracture (Materials) , Slurries

An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages

H. C. Cheng, K. N. Chiang, M. H. Lee

J. Electron. Packag. June 1998, 120(2): 129–134. doi: https://doi.org/10.1115/1.2792597

Abstract

View articletitled, An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages

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Topics: Ball-Grid-Array packaging , Finite element analysis , Optimization , Packaging , Solder joints

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

T.-Y. Tom Lee, R. Sharma, A. Peyre-Lavigne

J. Electron. Packag. June 1998, 120(2): 135–140. doi: https://doi.org/10.1115/1.2792599

Abstract

View articletitled, Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

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Topics: Carbon , Computational fluid dynamics , Design , Sensors , Steady state , Transients (Dynamics) , Cooling , Cycles , Electrical measurement , Energy consumption

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

X. Wu, X. Dou, C.-P. Yeh, K. Waytt

J. Electron. Packag. June 1998, 120(2): 141–144. doi: https://doi.org/10.1115/1.2792601

Abstract

View articletitled, Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

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Topics: Simulation , Solder joints , Solders , Geometry , Engineering simulation , Failure , Reliability , Wetting , Alloys , Computer simulation

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Z. Qian, M. Lu, S. Liu

J. Electron. Packag. June 1998, 120(2): 145–149. doi: https://doi.org/10.1115/1.2792605

Abstract

View articletitled, Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

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Topics: Modeling , Polymer films , Viscoelasticity , Viscoplasticity , Deformation , Stress , Chain , Constitutive equations , Drag (Fluid dynamics) , Temperature effects

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

X. Yan, R. K. Agarwal

J. Electron. Packag. June 1998, 120(2): 150–155. doi: https://doi.org/10.1115/1.2792607

Abstract

View articletitled, Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

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Topics: Flip-chip assemblies , Fracture toughness , Printed circuit boards , Stress , Fracture (Materials) , Silicon chips , Solder masks

A Review of Changes and Trends Affecting Military Electronics Manufacturing

A. J. Rafanelli

J. Electron. Packag. June 1998, 120(2): 156–159. doi: https://doi.org/10.1115/1.2792608

Abstract

View articletitled, A Review of Changes and Trends Affecting Military Electronics Manufacturing

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Topics: Electronics , Manufacturing , Military systems , Defense industry , Aerospace industry , Coatings , Design , Proton exchange membranes

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

J. Zhu, D. Zou, S. Liu

J. Electron. Packag. June 1998, 120(2): 160–165. doi: https://doi.org/10.1115/1.2792609

Abstract

View articletitled, Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

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Topics: Simulation , Thermal deformation , Finite element analysis , Diffraction patterns , Electronic packaging , Interferometry , Reliability , Temperature , Diffraction gratings , Displacement

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang

J. Electron. Packag. June 1998, 120(2): 166–170. doi: https://doi.org/10.1115/1.2792612

Abstract

View articletitled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

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Topics: Semiconductor wafers , Shades and shadows , Diffraction gratings , Diffraction patterns , Inspection , Resolution (Optics) , Warping , Lasers , Light sources , Probes

Investigation of the Lead-On-Chip Package’s Reliability

P.-H. Tsao, L. C. Chang, T. C. Chen, C. Haung, C. Z. Chen

J. Electron. Packag. June 1998, 120(2): 171–174. doi: https://doi.org/10.1115/1.2792613

Abstract

View articletitled, Investigation of the Lead-On-Chip Package’s Reliability

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Topics: Reliability , Epoxy adhesives , Epoxy resins , Silicon chips , Crack propagation , Failure mechanisms , Finite element analysis , Fracture (Materials) , Manufacturing , Molding

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

K.-N. Chiang, W.-L. Chen

J. Electron. Packag. June 1998, 120(2): 175–178. doi: https://doi.org/10.1115/1.2792616

Abstract

View articletitled, Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

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Topics: Ball-Grid-Array packaging , Electronic packaging , Shapes , Solder masks , Solder joints , Density , Energy conservation , Failure , Fatigue , Gravity (Force)

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

J. Wang, Z. Qian, D. Zou, S. Liu

J. Electron. Packag. June 1998, 120(2): 179–185. doi: https://doi.org/10.1115/1.2792617

Abstract

View articletitled, Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

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Topics: Creep , Finite element methods , Flip-chip packages , Interferometry , Modeling , Deformation , Displacement , Solders , Stress , Finite element analysis

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Y. Guo, S. Liu

J. Electron. Packag. June 1998, 120(2): 186–193. doi: https://doi.org/10.1115/1.2792619

Abstract

View articletitled, Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

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Topics: Electronic packaging , Event history analysis , Stress , Reliability , Failure , Packaging , Cycles , Design , Electronic packages , Electronic products

Technical Papers

Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package

I. Chaudhry, F. Barez

J. Electron. Packag. June 1998, 120(2): 194–200. doi: https://doi.org/10.1115/1.2792620

Abstract

View articletitled, Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package

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Topics: Cavities , Optimization , Wire , Temperature , Cycles , Finite element model , Simulation results , Stress , Failure mechanisms , Simulation

Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets

E. B. Zimmerman, G. T. Colwell

J. Electron. Packag. June 1998, 120(2): 201–206. doi: https://doi.org/10.1115/1.2792621

Abstract

View articletitled, Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets

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Topics: Temperature , Computer simulation , Electronics , Failure , Shades and shadows , Structures

Fatigue Life Estimation of Solder Joints in SMT-PGA Packages

M. Mukai, T. Kawakami, Y. Hiruta, K. Takahashi, K. Kishimoto, T. Shibuya

J. Electron. Packag. June 1998, 120(2): 207–212. doi: https://doi.org/10.1115/1.2792623

Abstract

View articletitled, Fatigue Life Estimation of Solder Joints in SMT-PGA Packages

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Topics: Fatigue life , Solder joints , Constitutive equations , Creep , Solders , Cycles , Electronic components , Failure , Stress analysis (Engineering) , Surface mount technology

Book Review

Printed Circuits Handbook, Fourth Edition

Clyde F. Coombs, Author, Anthony J. Rafanelli, Reviewer

J. Electron. Packag. June 1998, 120(2): 213–214. doi: https://doi.org/10.1115/1.2792624

View articletitled, <em>Printed Circuits Handbook, Fourth Edition</em>

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Topics: Circuits

Preface

Special Section on Manufacturing for the Electronics Industry

Special Section Technical Papers

CBGA Solder Fillet Shape Prediction and Design Optimization

Modeling Stresses of Contacts in Wire Saw Slicing of Polycrystalline and Crystalline Ingots: Application to Silicon Wafer Production

An Effective Approach for Three-Dimensional Finite Element Analysis of Ball Grid Array Typed Packages

Transient and Steady-State Thermal Design Evaluation of a Carbon Monoxide Gas Sensor Using CFD Tool

Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow

Constitutive Modeling of Polymer Films From Viscoelasticity to Viscoplasticity

Two Test Specimens for Determining the Interfacial Fracture Toughness in Flip-Chip Assemblies

A Review of Changes and Trends Affecting Military Electronics Manufacturing

Real-Time Monitoring and Simulation of Thermal Deformation in Plastic Package

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

Investigation of the Lead-On-Chip Package’s Reliability

Electronic Packaging Reflow Shape Prediction for the Solder Mask Defined Ball Grid Array

Creep Behavior of a Flip-Chip Package by Both FEM Modeling and Real Time Moire´ Interferometry

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Technical Papers

Optimization of Wire Loop Height for a Cavity Down Plastic Pin Grid Array Package

Installation Effects on Air Temperatures Within Outdoor Electronic Cabinets

Fatigue Life Estimation of Solder Joints in SMT-PGA Packages

Book Review

Printed Circuits Handbook, Fourth Edition

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Preface

Special Section Technical Papers

Technical Papers

Book Review

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ASME Journals

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