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Issues
December 2005
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Comparative Study of the Dissolution Kinetics of Electrolytic Ni and Electroless NiP Layers by Molten Sn3.5Ag Solder Alloy
J. Electron. Packag. December 2005, 127(4): 365–369.
doi: https://doi.org/10.1115/1.2056567
Topics:
Solder joints
,
Solders
,
Stress
,
Tin
,
Alloys
,
Shear (Mechanics)
,
Diffusion (Physics)
,
Lead-free solders
Time-Dependent Rheological Behavior of Fluids For Electronics Packaging
J. Electron. Packag. December 2005, 127(4): 370–374.
doi: https://doi.org/10.1115/1.2056568
Topics:
Die cutting
,
Electronic packaging
,
Fluids
,
Rheology
,
Shearing (Deformation)
,
Viscosity
,
Shear rate
,
Flow (Dynamics)
,
Adhesives
Behavior of Anisotropic Conductive Film (ACF) Joint under Mechanical Shock
J. Electron. Packag. December 2005, 127(4): 375–380.
doi: https://doi.org/10.1115/1.2056570
Topics:
Anisotropy
,
Contact resistance
,
Shock (Mechanics)
,
Particulate matter
,
Abrasion
A Systematic Methodology for Optimal Design of Two-Phase Micro-Channel Heat Sinks
J. Electron. Packag. December 2005, 127(4): 381–390.
doi: https://doi.org/10.1115/1.2056571
Topics:
Design
,
Flow (Dynamics)
,
Heat sinks
,
Microchannels
,
Pressure drop
,
Heat flux
,
Dimensions
,
Coolants
,
Temperature
A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
J. Electron. Packag. December 2005, 127(4): 391–396.
doi: https://doi.org/10.1115/1.2056573
Topics:
Algorithms
,
Laser beams
,
Optical fiber
,
Simulated annealing
,
Uncertainty
,
Temperature
,
Lasers
Design Optimization for Pin-Fin Heat Sinks
J. Electron. Packag. December 2005, 127(4): 397–406.
doi: https://doi.org/10.1115/1.2056572
Topics:
Design
,
Heat sinks
,
Optimization
,
Thermal resistance
,
Pressure drop
,
Response surface methodology
,
Heat
A Strain Rate Ratio Approach for Assessing Creep-Fatigue Life of 63Sn-37Pb Solder Under Shear Loading
J. Electron. Packag. December 2005, 127(4): 407–414.
doi: https://doi.org/10.1115/1.2070091
Topics:
Creep
,
Fatigue
,
Solders
,
Fatigue life
,
Damage
,
Shear (Mechanics)
,
Waves
,
Ductility
Systematic Study on Thermo-Mechanical Durability of Pb-Free Assemblies: Experiments and FE Analysis
J. Electron. Packag. December 2005, 127(4): 415–429.
doi: https://doi.org/10.1115/1.2098812
Topics:
Durability
,
Finite element analysis
,
Solder joints
,
Solders
,
Thermomechanics
,
Stress
,
Damage
,
Cycles
,
Vehicles
,
Lead-free solders
Experimental In Situ Characterization and Creep Modeling of Tin-Based Solder Joints on Commercial Area Array Packages at −40 °C , 23 °C , and 125 °C
Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John J. Gillespie, Jr.
J. Electron. Packag. December 2005, 127(4): 430–439.
doi: https://doi.org/10.1115/1.2070049
Topics:
Creep
,
Relaxation (Physics)
,
Solders
,
Stress
,
Temperature
,
Shear (Mechanics)
,
Modeling
,
Solder joints
Effect of Reversing Heat Flux Direction During Reflow on Void Formation in High-Lead Solder Bumps
J. Electron. Packag. December 2005, 127(4): 440–445.
doi: https://doi.org/10.1115/1.2070047
Topics:
Cooling
,
Heat flux
,
Heating
,
Solders
,
Solidification
,
Melting
,
Flow (Dynamics)
Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
J. Electron. Packag. December 2005, 127(4): 446–451.
doi: https://doi.org/10.1115/1.2070090
Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet
J. Electron. Packag. December 2005, 127(4): 452–459.
doi: https://doi.org/10.1115/1.2056575
Topics:
Air flow
,
Blades
,
Computational fluid dynamics
,
Cooling
,
Energy dissipation
,
Entropy
,
Flow (Dynamics)
,
Temperature
,
Thermal management
,
Heat
Rapid Temperature Cycling (RTC) Methodology for Reliability Assessment of Solder Interconnection in Tape Ball Grid Array (TBGA) Assembly
J. Electron. Packag. December 2005, 127(4): 466–473.
doi: https://doi.org/10.1115/1.2056574
Topics:
Rapid tooling
,
Reliability
,
Temperature
,
Failure
,
Ball-Grid-Array packaging
,
Solder joints
,
Manufacturing
,
Solders
,
Testing
Thermal Performance Investigation for Confined Heat Sinks By Using a Modified Transient Liquid Crystal Technique
J. Electron. Packag. December 2005, 127(4): 474–482.
doi: https://doi.org/10.1115/1.2065787
Test Method Development to Quantify the In Situ Elastic and Plastic Behavior of 62%Sn–36%Pb–2%Ag Solder Ball Arrays in Commercial Area Array Packages at −40 °C , 23 °C, and 125 °C
Ahmad Abu Obaid, Jay G. Sloan, Mark A. Lamontia, Antonio Paesano, Subhotosh Khan, John W. Gillespie, Jr.
J. Electron. Packag. December 2005, 127(4): 483–495.
doi: https://doi.org/10.1115/1.2070048
Topics:
Printed circuit boards
,
Shear (Mechanics)
,
Solders
,
Stress
Board Level Drop Impact—Fundamental and Parametric Analysis
J. Electron. Packag. December 2005, 127(4): 496–502.
doi: https://doi.org/10.1115/1.2065747
Topics:
Stress
,
Dynamics (Mechanics)
,
Springs
,
Manufacturing
Meso Scale Pulsating Jets for Electronics Cooling
J. Electron. Packag. December 2005, 127(4): 503–511.
doi: https://doi.org/10.1115/1.2065727
Topics:
Heat
,
Heat flux
,
Heat transfer
,
Heat transfer coefficients
,
Jets
,
Natural convection
,
Temperature
,
Temperature measurement
,
Thermal management
,
Cooling
Isothermal Mechanical Durability of Three Selected PB-Free Solders: Sn3.9Ag0.6Cu, Sn3.5Ag, and Sn0.7Cu
J. Electron. Packag. December 2005, 127(4): 512–522.
doi: https://doi.org/10.1115/1.2056569
Topics:
Damage
,
Durability
,
Lead-free solders
,
Solders
,
Stress
,
Temperature
,
Tin
,
Solder joints
A Numerical Study of the Enhancement of Chip Cooling via a Flow-Disturbing Obstruction Block
J. Electron. Packag. December 2005, 127(4): 523–529.
doi: https://doi.org/10.1115/1.2070089
Topics:
Cooling
,
Flow (Dynamics)
,
Fluids
,
Locks (Waterways)
,
Pressure
,
Temperature
,
Vibration
,
Heat
,
Heat transfer
,
Convection
Research Papers
Moisture Absorption and Diffusion Characterization of Molding Compound
J. Electron. Packag. December 2005, 127(4): 460–465.
doi: https://doi.org/10.1115/1.2065707
Topics:
Absorption
,
Diffusion (Physics)
,
Molding
Technology Review
State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
J. Electron. Packag. December 2005, 127(4): 530–536.
doi: https://doi.org/10.1115/1.2070092
Book Reviews
Environment-Friendly Electronics: Lead-Free Technology
J. Electron. Packag. December 2005, 127(4): 537–538.
doi: https://doi.org/10.1115/1.2070093
Topics:
Alloys
,
Electronics
,
Lead-free solders
,
Solders
,
Electronic packaging
,
Soldering
,
Tin
,
Low cycle fatigue
Practical Guide to the Packaging of Electronics
J. Electron. Packag. December 2005, 127(4): 539.
doi: https://doi.org/10.1115/1.2070094
Topics:
Electronic packaging
,
Design
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