Skip Nav Destination
Issues
September 2012
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Impact of Self-Assembly Process Errors on Thermoelectric Performance
J. Electron. Packag. September 2012, 134(3): 031001.
doi: https://doi.org/10.1115/1.4006709
Topics:
Errors
,
Manufacturing
,
Self-assembly
,
Thermal conductivity
,
Probability
,
Redundancy (Engineering)
,
Simulation
,
Temperature
,
Junctions
,
Heat
Modeling of Thermoplastic Materials for the Process-Simulation of Press-Fit Interconnections on Moulded Interconnected Devices
J. Electron. Packag. September 2012, 134(3): 031002.
doi: https://doi.org/10.1115/1.4006927
Topics:
Creep
,
Modeling
,
Press fits
,
Reliability
,
Simulation
,
Stress
,
Temperature
,
Deformation
,
Friction
,
Manufacturing
Study of Solder/Copper Interface Behavior Under Varying Strain Rates
J. Electron. Packag. September 2012, 134(3): 031003.
doi: https://doi.org/10.1115/1.4006862
Topics:
Copper
,
Failure
,
Fracture (Materials)
,
Fracture (Process)
,
Solders
,
Stress
,
Temperature
,
Yield strength
,
Density
,
Solder joints
Parameter Calibrations on MOSFET Stress Sensors
J. Electron. Packag. September 2012, 134(3): 031004.
doi: https://doi.org/10.1115/1.4006888
Topics:
Calibration
,
MOSFET transistors
,
Sensors
,
Stress
,
Temperature
Characterization of Compressive Die Stresses in CBGA Microprocessor Packaging Due to Component Assembly and Heat Sink Clamping
Jordan C. Roberts, Mohammad Motalab, Safina Hussain, Jeffrey C. Suhling, Richard C. Jaeger, Pradeep Lall
J. Electron. Packag. September 2012, 134(3): 031005.
doi: https://doi.org/10.1115/1.4006910
Topics:
Stress
,
Manufacturing
,
Packaging
,
Sensors
,
Heat sinks
Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance
J. Electron. Packag. September 2012, 134(3): 031006.
doi: https://doi.org/10.1115/1.4006708
Topics:
Ball-Grid-Array packaging
,
Electrical resistance
,
Fracture (Materials)
,
Shear (Mechanics)
,
Stress
,
Cycles
,
Fatigue cracks
,
Failure
,
Fatigue
,
Shear stress
Bulk Resistance Evaluation of Anisotropic Conductive Adhesive Particles Considering the Current Bending Effect
J. Electron. Packag. September 2012, 134(3): 031007.
doi: https://doi.org/10.1115/1.4006889
Topics:
Deformation
,
Finite element analysis
,
Particulate matter
,
Bonding
,
Adhesives
,
Anisotropy
Norris–Landzberg Acceleration Factors and Goldmann Constants for SAC305 Lead-Free Electronics
J. Electron. Packag. September 2012, 134(3): 031008.
doi: https://doi.org/10.1115/1.4006863
Topics:
Cycles
,
Eigenvalues
,
Electronics
,
Failure
,
Model development
,
Reliability
,
Solders
,
Temperature
,
Thermal expansion
,
Thermomechanics
Absorption Heat Pump/Refrigeration System Utilizing Ionic Liquid and Hydrofluorocarbon Refrigerants
J. Electron. Packag. September 2012, 134(3): 031009.
doi: https://doi.org/10.1115/1.4007111
Topics:
Absorption
,
Fluids
,
Heat pumps
,
Refrigerants
,
Refrigeration
,
Temperature
,
Pressure
,
Cooling
,
Heat
Effect of Shield-Can on Dynamic Response of Board-Level Assembly
J. Electron. Packag. September 2012, 134(3): 031010.
doi: https://doi.org/10.1115/1.4007118
Topics:
Deformation
,
Dynamic response
,
Failure
,
Finite element model
,
Shapes
,
Solder joints
,
Stress
,
Displacement
,
Stress analysis (Engineering)
,
Manufacturing
Technical Briefs
Thermal Assessment of Naturally Cooled Electronic Enclosures With Rectangular Fins
J. Electron. Packag. September 2012, 134(3): 034501.
doi: https://doi.org/10.1115/1.4007077
Topics:
Fins
,
Heat transfer
,
Natural convection
,
Radiation (Physics)
,
Temperature
Email alerts
RSS Feeds
Optimization of Micropillars Electroplating Bonding Processes and Additives
J. Electron. Packag (June 2025)
Microbead Encapsulation for Protection of Electronic Components
J. Electron. Packag (June 2025)