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Volume 142, Issue 1

March 2020

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Review Article
Research Papers
Technical Briefs

Review Article

Packaging for Laser-Based White Lighting: Status and Perspectives

Yupu Ma, Xiaobing Luo

J. Electron. Packag. March 2020, 142(1): 010801. doi: https://doi.org/10.1115/1.4044359

Abstract

View articletitled, Packaging for Laser-Based White Lighting: Status and Perspectives

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Topics: Lasers , Packaging , Phosphors , Quenching (Metalworking) , Temperature , Laser beams , Brightness (Photometry)

Research Papers

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011001. doi: https://doi.org/10.1115/1.4043704

Abstract

View articletitled, Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

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Topics: Package on package , Probability , Solders , Uncertainty , Warping , Manufacturing

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Hsiu-Ping Wei, Yu-Hsiang Yang, Bongtae Han

J. Electron. Packag. March 2020, 142(1): 011002. doi: https://doi.org/10.1115/1.4044218

Abstract

View articletitled, Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

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Topics: Corners (Structural elements) , Density , Package on package , Probability , Solders , Uncertainty , Warping , Manufacturing , Solder joints

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Yanghe Liu, Shailesh N. Joshi, Ercan M. Dede

J. Electron. Packag. March 2020, 142(1): 011003. doi: https://doi.org/10.1115/1.4044476

Abstract

View articletitled, Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

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Topics: Bonding , Electronics , High temperature , Manufacturing , Stress , Tension-leg platforms , Thermal stresses , Tin , Transients (Dynamics) , Temperature

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Hsien-Chie Cheng, Yan-Cheng Liu

J. Electron. Packag. March 2020, 142(1): 011004. doi: https://doi.org/10.1115/1.4044625

Abstract

View articletitled, Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

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Topics: Semiconductor wafers , Shrinkage (Materials) , Temperature , Warping , Molding , Manufacturing , Epoxy resins , Packaging , Epoxy adhesives

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang

J. Electron. Packag. March 2020, 142(1): 011005. doi: https://doi.org/10.1115/1.4044278

Abstract

View articletitled, Empirical High Cycle Fatigue Assessment Model of MEMS Devices

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Topics: Design , Fatigue life , High cycle fatigue , Microelectromechanical systems , Silicon-on-insulator , Simulation , Stress , Torsion , Cycles , Damage

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Jisu Jiang, Landon Keller, Paul A. Kohl

J. Electron. Packag. March 2020, 142(1): 011006. doi: https://doi.org/10.1115/1.4044626

Abstract

View articletitled, Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Supplementary data

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Topics: Epoxy adhesives , Epoxy resins , Porosity

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Wan-Chun Chuang, Wei-Long Chen

J. Electron. Packag. March 2020, 142(1): 011007. doi: https://doi.org/10.1115/1.4044489

Abstract

View articletitled, Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

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Topics: Cycles , Fatigue life , Semiconductor wafers , Simulation models , Solders , Stress , Temperature , Creep , Assembly lines , Simulation results

Impact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Center

Wen-Xiao Chu, Jui-Lin Wu, Yeng-Yung Tsui, Chi-Chuan Wang

J. Electron. Packag. March 2020, 142(1): 011008. doi: https://doi.org/10.1115/1.4044775

Abstract

View articletitled, Impact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Center

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Topics: Air flow , Computational fluid dynamics , Containers , Data centers , Temperature , Ceilings , Cooling

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Jinxin Liu, Zhiheng Huang, Paul P. Conway, Yang Liu

J. Electron. Packag. March 2020, 142(1): 011009. doi: https://doi.org/10.1115/1.4044648

Abstract

View articletitled, Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

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Topics: Grain size , Shear (Mechanics) , Simulation , Deformation , Reliability , Atoms , Simulation results , Copper

Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty

J. Electron. Packag. March 2020, 142(1): 011010. doi: https://doi.org/10.1115/1.4045156

Abstract

View articletitled, Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

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Topics: Fluids , Pumps , Temperature , Thermocouples , Low temperature , Energy consumption

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Abel Misrak, Tushar Chauhan, Pavan Rajmane, Rabin Bhandari, Dereje Agonafer

J. Electron. Packag. March 2020, 142(1): 011011. doi: https://doi.org/10.1115/1.4045157

Abstract

View articletitled, Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

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Topics: Fillers (Materials) , Fourier transform infrared spectroscopy , Infrared spectroscopy , Mechanical properties , Stress , Temperature , Testing , Thermomechanics , High temperature , Reliability

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Neil Dalal, Yuan Gu, Guang Chen, Daniel R. Hines, Abhijit Dasgupta, Siddhartha Das

J. Electron. Packag. March 2020, 142(1): 011012. doi: https://doi.org/10.1115/1.4044960

Abstract

View articletitled, Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Supplementary data

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Topics: Aerosols , Electrical conductivity , Flow (Dynamics) , Gas flow , Inks , Magnification , Nanoparticles , Printing , Silver , Agglomeration (Materials)

Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity

Xiaoguang Huang, Zhiqiang Wang

J. Electron. Packag. March 2020, 142(1): 011013. doi: https://doi.org/10.1115/1.4045255

Abstract

View articletitled, Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity

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Topics: Fatigue , Stress , Fatigue testing , Solders , Cycles

Technical Briefs

Additive-Manufactured Organic Interposers

A. Roshanghias, M. Krivec, J. Bardong, A. Binder

J. Electron. Packag. March 2020, 142(1): 014501. doi: https://doi.org/10.1115/1.4044279

Abstract

View articletitled, Additive-Manufactured Organic Interposers

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Topics: Additive manufacturing , Manufacturing , Printing

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

Wen-Xiao Chu, Hao-Yu Lin, Chi-Chuan Wang

J. Electron. Packag. March 2020, 142(1): 014502. doi: https://doi.org/10.1115/1.4044774

Abstract

View articletitled, Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

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Topics: Contact resistance , Melting , Optical fiber , Temperature , Pressure , Alloys , Stress , Heating , Surface roughness , Heat sinks

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Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate

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Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability

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Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads

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Review Article

Packaging for Laser-Based White Lighting: Status and Perspectives

Research Papers

Stacking Yield Prediction of Package-on-Package Assembly Using Advanced Uncertainty Propagation Analysis: Part I Stochastic Model Development

Stacking Yield Prediction of Package-on-Package Assembly Using Uncertainty Propagation Analysis—Part II: Implementation of Stochastic Model

Novel Transient Liquid Phase Bonding for High-Temperature Automotive Power Electronics Systems

Warpage Characterization of Molded Wafer for Fan-Out Wafer-Level Packaging

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Low-Dielectric Constant Nanoporous Epoxy for Electronic Packaging

Fatigue Prediction for Molded Wafer-Level Package During Temperature Cycling

Impact of Overhead Air Supply Layout on the Thermal Performance of a Container Data Center

Microstructural Evolution and Protrusion Simulations of Cu-TSVs Under Different Loading Conditions

Measurement of the Thermal Performance of a Custom-Build Single-Phase Immersion Cooled Server at Various High and Low Temperatures for Prolonged Time

Impact of Aging on Mechanical Properties of Thermally Conductive Gap Fillers

Effect of Gas Flow Rates on Quality of Aerosol Jet Printed Traces With Nanoparticle Conducting Ink

Thermal Fatigue Evaluation Model of a Microelectronic Chip in Terms of Interfacial Singularity

Technical Briefs

Additive-Manufactured Organic Interposers

Experimental Study on Thermal Contact Resistance Improvement for Optical Fiber by Using Low-Melting Temperature Alloy

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