Skip Nav Destination
Issues
June 2024
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Hybrid Substrates for Heterogeneous Integration
John H. Lau, Gary Chang-Fu Chen, Channing Cheng-Lin Yang, Vincent Teng, Andy Yan-Jia Peng, Jones Yu-Cheng Huang, Hsing-Ning Liu, Y. H. Chen, Tzyy-Jang Tseng, Ming Li
J. Electron. Packag. June 2024, 146(2): 021001.
doi: https://doi.org/10.1115/1.4062993
Topics:
Bonding
,
Metals
,
Solder joints
,
Reliability
,
Dielectric materials
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life
J. Electron. Packag. June 2024, 146(2): 021002.
doi: https://doi.org/10.1115/1.4063058
Topics:
Fatigue life
,
Resistors
,
Shapes
,
Solder joints
,
Solders
,
Thermal shock
,
Manufacturing
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, H. Alan Mantooth, Kenneth E. Goodson
J. Electron. Packag. June 2024, 146(2): 021003.
doi: https://doi.org/10.1115/1.4062924
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
J. Electron. Packag. June 2024, 146(2): 021004.
doi: https://doi.org/10.1115/1.4062868
Topics:
Solders
,
Temperature
,
Shock (Mechanics)
,
Alloys
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
J. Electron. Packag. June 2024, 146(2): 021005.
doi: https://doi.org/10.1115/1.4063252
Topics:
Flow (Dynamics)
,
Heat exchangers
,
Refrigerants
,
Temperature
,
Heat
,
Cooling
,
Fluids
,
Pressure
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
J. Electron. Packag. June 2024, 146(2): 021006.
doi: https://doi.org/10.1115/1.4063919
Topics:
Stress
,
Warping
,
Temperature
,
Silicon
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant V. J. Narumanchi, Yogendra Joshi
J. Electron. Packag. June 2024, 146(2): 021007.
doi: https://doi.org/10.1115/1.4062869
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications
J. Electron. Packag. June 2024, 146(2): 021008.
doi: https://doi.org/10.1115/1.4063917
Topics:
Acoustics
,
Blades
,
Experimental design
,
Flow (Dynamics)
,
Noise (Sound)
,
Pressure
,
Rotors
,
Optimization
,
Geometry
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
J. Electron. Packag. June 2024, 146(2): 021009.
doi: https://doi.org/10.1115/1.4064098
The Research for Quickly Measuring the Diameter and Roundness of Solder Balls Based on Machine Vision Technology
J. Electron. Packag. June 2024, 146(2): 021010.
doi: https://doi.org/10.1115/1.4063918
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials
J. Electron. Packag. June 2024, 146(2): 021011.
doi: https://doi.org/10.1115/1.4064099
Topics:
Energy dissipation
,
Heat
,
Topology optimization
,
Design
,
Density
,
Temperature
,
Topology
,
Phase change materials
Email alerts
RSS Feeds
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation
J. Electron. Packag (December 2024)
Special Issue on InterPACK2023
J. Electron. Packag
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes
J. Electron. Packag (December 2024)
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films
J. Electron. Packag (March 2025)
