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Journal Articles

Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm

Daiki Higuma, João Vitor Thomsen Silveira, Byunggi Kim, Masahiro Nomura, Kazuyoshi Fushinobu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041115.
Paper No: EP-24-1015
https://doi.org/10.1115/1.4066086
Published Online: August 17, 2024
View Article titled, Thermal Property Estimation of Thin-Layered Structures by Means of Thermoreflectance Measurement and Network Identification by Deconvolution Algorithm
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Topics: Algorithms, Lasers, Thermal conductivity, Thermal properties, Thermoreflectance, Temperature, Heat, Flow (Dynamics), Thermal resistance, Interfacial thermal resistance
Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Article titled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm

Jiantao Zhang, Zhengfang Chang, Haida Xu, Dong Qu, Xinyu Shi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021009.
Paper No: EP-23-1046
https://doi.org/10.1115/1.4064098
Published Online: December 11, 2023
View Article titled, Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm
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Topics: Algorithms, Network models, Printed circuit boards, Artificial neural networks, Flaw detection
Journal Articles

Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging

Palash V. Acharya, Manojkumar Lokanathan, Abdelhamid Ouroua, Robert Hebner, Shannon Strank, Vaibhav Bahadur
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041109.
Paper No: EP-21-1087
https://doi.org/10.1115/1.4052814
Published Online: November 5, 2021
View Article titled, Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging
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Topics: Algorithms, Artificial neural networks, Bridges (Structures), Cooling, Heat sinks, Junctions, Machine learning, Machinery, Simulation, Steady state
Includes: Supplementary data
Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041106.
Paper No: EP-21-1120
https://doi.org/10.1115/1.4052465
Published Online: October 13, 2021
View Article titled, Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer
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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors
Journal Articles

Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging

Swapnil S. Salvi, Ankur Jain
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020901.
Paper No: EP-20-1058
https://doi.org/10.1115/1.4049291
Published Online: February 22, 2021
View Article titled, Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
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Topics: Algorithms, Circuits, Hardware, Heating, Image processing, Imaging, Resistors, Semiconductors (Materials), Temperature, Integrated circuits
Journal Articles

Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior

Sukshitha Achar P. L, Huanyu Liao, Ganesh Subbarayan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041005.
Paper No: EP-20-1011
https://doi.org/10.1115/1.4048729
Published Online: October 28, 2020
View Article titled, Comparative Evaluation of Algorithms for Achieving Ultrapacked Thermal Greases: Microstructural Models and Effective Behavior
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Topics: Algorithms, Particulate matter, Optimization, Network models
Journal Articles

Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits

Srikanth Rangarajan, Yaser Hadad, Leila Choobineh, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041109.
Paper No: EP-19-1123
https://doi.org/10.1115/1.4047471
Published Online: June 29, 2020
View Article titled, Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits
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Topics: Genetic algorithms, Heat, Optimization, Temperature, Artificial neural networks, Heat transfer, Integrated circuits, Algorithms, Boundary-value problems
Journal Articles

Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities

Tom Saenen, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010901.
Paper No: EP-15-1091
https://doi.org/10.1115/1.4032490
Published Online: March 10, 2016
View Article titled, Dynamic Numerical Microchannel Evaporator Model to Investigate Parallel Channel Instabilities
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Topics: Flow (Dynamics), Heat conduction, Microchannels, Algorithms, Simulation, Stability
Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2014, 136(4): 040201.
Paper No: EP-14-1070
https://doi.org/10.1115/1.4028390
Published Online: September 19, 2014
View Article titled, Special Section on InterPACK 2013
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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management
Journal Articles

Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration

Pradeep Lall, Ryan Lowe
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041013.
Paper No: EP-14-1004
https://doi.org/10.1115/1.4028163
Published Online: September 19, 2014
View Article titled, Comparison of Prognostic Health Management Algorithms for Assessment of Electronic Interconnect Reliability Under Vibration
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Topics: Algorithms, Filters, Kalman filters, Particulate matter
Journal Articles

Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit

Michael J. Ellsworth, Jr., Randy J. Zoodsma, Frank Cascio, Eileen Behrendt
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041009.
Paper No: EP-13-1124
https://doi.org/10.1115/1.4028119
Published Online: September 19, 2014
View Article titled, Design and Control of the IBM Power 775 Supercomputer Water Conditioning Unit
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Topics: Design, Flow (Dynamics), Pumps, Reservoirs, Sensors, Temperature, Water, Valves, Algorithms, Electronics
Journal Articles

Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control

Rui Zhang, Marc Hodes, David A. Brooks, Vincent P. Manno
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021007.
https://doi.org/10.1115/1.4005905
Published Online: June 11, 2012
View Article titled, Optimized Thermoelectric Module-Heat Sink Assemblies for Precision Temperature Control
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Topics: Algorithms, Circuits, Heat, Temperature, Temperature control, Thermal resistance, Thermoelectric cooling, Energy consumption, Photonics, Heat sinks
Journal Articles

Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis

Lihua Liang, Yuanxiang Zhang, Yong Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031002.
https://doi.org/10.1115/1.4004658
Published Online: September 14, 2011
View Article titled, Prediction of Electromigration Failure of Solder Joints and Its Sensitivity Analysis
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Topics: Algorithms, Density, Electrodiffusion, Failure, Sensitivity analysis, Simulation, Solder joints, Solders, Current density, Stress
Journal Articles

Electromigration Simulation for Metal Lines

JianPing Jing, Lihua Liang, Guang Meng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011002.
https://doi.org/10.1115/1.4000716
Published Online: March 4, 2010
View Article titled, Electromigration Simulation for Metal Lines
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Topics: Algorithms, Atoms, Density, Electrodiffusion, Simulation, Stress, Current density, Failure, Metals, Temperature
Journal Articles

Steady-State Behavior of a Three-Dimensional Pool-Boiling System

Michel Speetjens
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041102.
https://doi.org/10.1115/1.2993147
Published Online: November 13, 2008
View Article titled, Steady-State Behavior of a Three-Dimensional Pool-Boiling System
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Topics: Bifurcation, Boiling, Cooling, Fluids, Heat, Heat flux, Pool boiling, Steady state, Temperature, Heat transfer
Journal Articles

A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System

Satish Radhakrishnan, Ganesh Subbarayan, Luu Nguyen, William P. Mazotti
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 391–396.
https://doi.org/10.1115/1.2056573
Published Online: December 14, 2004
View Article titled, A Systems Approach for Analyzing Uncertainties in Misalignment of a Fiberoptic System
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Topics: Algorithms, Laser beams, Optical fiber, Simulated annealing, Uncertainty, Temperature, Lasers
Journal Articles

Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications

Xianjie Yang, C. L. Chow, K. J. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2004, 126(1): 148–158.
https://doi.org/10.1115/1.1649246
Published Online: April 30, 2004
View Article titled, Time Integration Algorithm for a Cyclic Damage Coupled Thermo-Viscoplasticity Model for 63Sn-37Pb Solder Applications
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Topics: Algorithms, Computer simulation, Constitutive equations, Damage, Hardening, Shear (Mechanics), Solders, Stress, Viscoplasticity, Finite element analysis
Journal Articles

Determination of Packaging Material Properties Utilizing Image Correlation Techniques

D. Vogel, R. Ku¨hnert, M. Dost, B. Michel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 345–351.
https://doi.org/10.1115/1.1506698
Published Online: December 12, 2002
View Article titled, Determination of Packaging Material Properties Utilizing Image Correlation Techniques
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Topics: Atomic force microscopy, Deformation, Displacement, Displacement measurement, Flip-chip devices, Fracture (Materials), Materials properties, Packaging, Reliability, Stress
Journal Articles

A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures

J. H. Ong, G. H. Lim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2000, 122(4): 341–349.
https://doi.org/10.1115/1.1289632
Published Online: February 25, 2000
View Article titled, A Simple Technique for Maximizing the Fundamental Frequency of Vibrating Structures
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Topics: Boundary-value problems, Mode shapes, Optimization, Printed circuit boards, Vibration, Finite element analysis, Cantilevers, Algorithms, Density, Plates (structures)