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Journal Articles

Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network

Liwen Zhang, Chen Yang, He Yang, Jinchan Wang, Jincan Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031003.
Paper No: EP-23-1065
https://doi.org/10.1115/1.4064522
Published Online: February 7, 2024
View Article titled, Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network
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Topics: Algorithms, Artificial neural networks, Errors, Fracture (Materials), Neural network models, Optimization algorithms, Reliability, Silicon, Finite element methods, Modeling
Journal Articles

Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges

Y. W. Wang, M. Y. Tsai, Y. S. Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031001.
Paper No: EP-23-1070
https://doi.org/10.1115/1.4064354
Published Online: January 8, 2024
View Article titled, Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges
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Topics: Finite element methods, Flip-chip packages, Gages, Strain gages, Warping
Journal Articles

An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging

Fei Qin, Qi He, Yanpeng Gong, Chuantao Hou, Hao Cheng, Tong An, Yanwei Dai, Pei Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021003.
Paper No: EP-22-1036
https://doi.org/10.1115/1.4055125
Published Online: August 18, 2022
View Article titled, An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
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Topics: Boundary element methods, Finite element methods, Finite element model, Stiffness, Electronic packaging, Finite element analysis, Displacement, Traction
Journal Articles

Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations

Tae-Wook Kim, Jae-Min Kim, Hyeon-Ji Yun, Jong-Sung Lee, Jae-Hak Lee, Jun-Yeob Song, Young-Chang Joo, Won-Jun Lee, Byoung-Joon Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041017.
Paper No: EP-21-1014
https://doi.org/10.1115/1.4054183
Published Online: April 22, 2022
View Article titled, Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations
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Topics: Deformation, Electrical resistance, Fatigue, Metals, Molding, Polymers, Reliability, Silicon, Simulation, Stress
Includes: Supplementary data
Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011003.
Paper No: EP-20-1083
https://doi.org/10.1115/1.4050696
Published Online: August 6, 2021
View Article titled, Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package
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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis
Journal Articles

Study of Electromigration-Induced Stress of Solder

Fei Su, Zheng Zhang, Yuan Wang, Weijia Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021006.
Paper No: EP-14-1025
https://doi.org/10.1115/1.4029463
Published Online: June 1, 2015
View Article titled, Study of Electromigration-Induced Stress of Solder
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Topics: Deformation, Electrodiffusion, Finite element methods, Solders, Stress
Journal Articles

Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package

Takahiro Kinoshita, Takashi Kawakami, Tatsuhiro Hori, Keiji Matsumoto, Sayuri Kohara, Yasumitsu Orii, Fumiaki Yamada, Morihiro Kada
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020903.
https://doi.org/10.1115/1.4006515
Published Online: June 11, 2012
View Article titled, Thermal Stresses of Through Silicon Vias and Si Chips in Three Dimensional System in Package
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Topics: Finite element methods, Silicon, Silicon chips, Simulation, Stress, System-in-package, Thermal stresses, Temperature, Stress concentration
Journal Articles

Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections

Ping Nicole An, Paul A. Kohl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2011, 133(4): 041004.
https://doi.org/10.1115/1.4005289
Published Online: December 9, 2011
View Article titled, Modeling Simplification for Thermal Mechanical Analysis of High Density Chip-to-Substrate Connections
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Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling
Journal Articles

A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator

Paolo Emilio Bagnoli, Cristina Padovani, Andrea Pagni, Giuseppe Pasquinelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2011, 133(1): 011005.
https://doi.org/10.1115/1.4003516
Published Online: March 9, 2011
View Article titled, A Thermomechanical Solver for Multilayer Power Electronic Assemblies Integrated Into the DJOSER Thermal Simulator
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Topics: Finite element methods, Stress, Temperature, Thermomechanics, Finite element analysis, Thermal analysis
Journal Articles

Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages

Jie-Hua Zhao, Vikas Gupta, Alok Lohia, Darvin Edwards
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2010, 132(1): 011005.
https://doi.org/10.1115/1.4000754
Published Online: March 4, 2010
View Article titled, Reliability Modeling of Lead-Free Solder Joints in Wafer-Level Chip Scale Packages
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Topics: Constitutive equations, Creep, Density, Fatigue, Finite element methods, Hardening, Lead-free solders, Modeling, Reliability, Semiconductor wafers
Journal Articles

Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity

Esam M. Alawadhi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2009, 131(1): 011011.
https://doi.org/10.1115/1.3068322
Published Online: February 13, 2009
View Article titled, Thermal Management of Electronic Chips in a Channel Using Input Power to Control Flow Velocity
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Topics: Flow (Dynamics), Heat, Pressure drop, Reynolds number, Temperature, Thermal management, Transients (Dynamics), Steady state, Cycles, Finite element methods
Journal Articles

A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method

Siva P. Gurrum, Yogendra K. Joshi, William P. King, Koneru Ramakrishna, Martin Gall
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2008, 130(3): 031001.
https://doi.org/10.1115/1.2957318
Published Online: July 29, 2008
View Article titled, A Compact Approach to On-Chip Interconnect Heat Conduction Modeling Using the Finite Element Method
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Topics: Finite element methods, Heat conduction, Metals, Modeling, Simulation, Temperature, Chain, Finite element analysis, Thermal conductivity, Clocks
Journal Articles

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 449–455.
https://doi.org/10.1115/1.2353281
Published Online: February 15, 2006
View Article titled, Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components
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Topics: Computer cooling, Cooling, Design, Finite element analysis, Finite element model, Optimization, Printed circuit boards, Screws, Testing, Materials properties
Journal Articles

Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection

Liu Caroline Chen, Zonghe Lai, Zhaonian Cheng, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 177–183.
https://doi.org/10.1115/1.2227057
Published Online: August 7, 2005
View Article titled, Reliability Investigation for Encapsulated Isotropic Conductive Adhesives Flip Chip Interconnection
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Topics: Adhesives, Contact resistance, Finite element methods, Flip-chip devices, Reliability, Simulation, Stress, Temperature, Warping, Flip-chip
Journal Articles

Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components

Brian H. Dennis, Zhen-xue Han, George S. Dulikravich
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 457–464.
https://doi.org/10.1115/1.1827261
Published Online: January 24, 2005
View Article titled, Determination of Temperatures and Heat Fluxes on Surfaces and Interfaces of Multidomain Three-Dimensional Electronic Components
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Topics: Ball-Grid-Array packaging, Boundary-value problems, Errors, Flux (Metallurgy), Heat, Heat conduction, Temperature, Temperature distribution, Finite element analysis, Finite element methods
Journal Articles

Characterization of Substrate Materials for System-in-a-Package Applications

Liu Chen, Anders S. G. Andræ, Gang Zou, Johan Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 195–201.
https://doi.org/10.1115/1.1648057
Published Online: July 8, 2004
View Article titled, Characterization of Substrate Materials for System-in-a-Package Applications
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Topics: Ceramics, Cooling, Density, Epoxy resins, Finite element methods, Manufacturing, Microwaves, Reliability, System-in-package, Thermal expansion
Journal Articles

Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate

C. J. Liu, L. J. Ernst, G. Wisse, G. Q. Zhang, M. Vervoort
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 512–519.
https://doi.org/10.1115/1.1604152
Published Online: December 15, 2003
View Article titled, Thermally Induced Delamination Buckling of a Thin Metal Layer on a Ceramic Substrate
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Topics: Buckling, Ceramics, Copper, Delamination, Finite element methods, Finite element model, Simulation, Stress, Temperature, Deformation
Journal Articles

Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump

M. Carmona, S. Marco, J. Samitier, M. C. Acero, J. A. Plaza, J. Esteve
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2003, 125(4): 527–530.
https://doi.org/10.1115/1.1604154
Published Online: December 15, 2003
View Article titled, Modeling the Thermal Actuation in a Thermo-Pneumatic Micropump
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Topics: Micropumps, Simulation, Finite element methods, Engineering simulation, Modeling, Membranes, Thermomechanics
Journal Articles

Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages

Hideo Koguchi, Chie Sasaki, Kazuto Nishida
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 414–419.
https://doi.org/10.1115/1.1602705
Published Online: September 17, 2003
View Article titled, Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages
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Topics: Deflection, Temperature, Finite element methods, Plates (structures)
Journal Articles

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 134–138.
https://doi.org/10.1115/1.1535446
Published Online: March 14, 2003
View Article titled, Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging
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Topics: Delamination, Electronic packaging, Finite element analysis, Finite element methods, Laminates, Stress, Stress analysis (Engineering), Thermal stresses, Materials properties, Thermomechanics