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Journal Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Yuan Chen, Zhongyang Wang, Yuhui Fan, Ming Dong, Dengxue Liu

Publisher: ASME

J. Electron. Packag. September 2024, 146(3): 030801.

Paper No: EP-23-1037

https://doi.org/10.1115/1.4064361

Published Online: March 8, 2024

View Article titled, Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Topics: Imaging, Inspection, Lasers, Microelectronic packaging, Resolution (Optics), Nondestructive evaluation, Microscopy

Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

Publisher: ASME

J. Electron. Packag. March 2022, 144(1): 011009.

Paper No: EP-20-1126

https://doi.org/10.1115/1.4050898

Published Online: August 6, 2021

View Article titled, Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density

Journal Articles

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Guoyi Li, Hyunseong Lee, Aditi Chattopadhyay, Rajesh Kumar Neerukatti, Kuang C. Liu

Publisher: ASME

J. Electron. Packag. March 2021, 143(1): 011002.

Paper No: EP-19-1077

https://doi.org/10.1115/1.4047228

Published Online: June 4, 2020

View Article titled, Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Topics: Delamination, Inspection, Sealants, Signals, Waves, Nondestructive evaluation, Excitation, Integrated circuits

Journal Articles

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Benjamin Giron-Palomares, Xin Fu, Abel Hernandez-Guerrero, Bladimir Ramos-Alvarado

Publisher: ASME

J. Electron. Packag. September 2014, 136(3): 031008.

Paper No: EP-13-1114

https://doi.org/10.1115/1.4027378

Published Online: May 12, 2014

View Article titled, Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Topics: Inspection, Solders, Thermography, Temperature, Ball-Grid-Array packaging

Journal Articles

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Chaoran Yang, Fubin Song, S. W. Ricky Lee

Publisher: ASME

J. Electron. Packag. March 2014, 136(1): 011003.

Paper No: EP-12-1017

https://doi.org/10.1115/1.4025915

Published Online: November 28, 2013

View Article titled, Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Topics: Finishes, Solder joints, Solders, Tin, Temperature, Inspection

Journal Articles

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Jin Yang, Lizheng Zhang, I. Charles Ume, Camil Ghiu, George White

Publisher: ASME

J. Electron. Packag. June 2010, 132(2): 021006.

https://doi.org/10.1115/1.4001832

Published Online: June 23, 2010

View Article titled, Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Topics: Cycles, Inspection, Lasers, Reliability, Solder joints, Ultrasound, X-rays, Fracture (Materials)

Journal Articles

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Jin Yang, I. Charles Ume

Publisher: ASME

J. Electron. Packag. March 2009, 131(1): 011013.

https://doi.org/10.1115/1.3068301

Published Online: February 18, 2009

View Article titled, Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Topics: Electronic packages, Flip-chip devices, Lasers, Signals, Solders, Tin, Ultrasound, Vehicles, X-rays, Inspection

Journal Articles

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Jin Yang, I. Charles Ume

Publisher: ASME

J. Electron. Packag. September 2008, 130(3): 031009.

https://doi.org/10.1115/1.2957328

Published Online: August 1, 2008

View Article titled, Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Topics: Flip-chip, Flip-chip devices, Inspection, Lasers, Modal analysis, Solders, Ultrasound, Mode shapes

Journal Articles

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 157–161.

https://doi.org/10.1115/1.1536951

Published Online: March 14, 2003

View Article titled, Open Defects in PBGA Assembly Solder Joints

Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing

Journal Articles

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Sheng Liu, I. Charles Ume, Mem. ASME

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 39–43.

https://doi.org/10.1115/1.1525820

Published Online: March 14, 2003

View Article titled, Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Topics: Errors, Flip-chip devices, Inspection, Signal processing, Signals, Solder joints, Flip-chip, Data acquisition, Vibration

Journal Articles

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

Publisher: ASME

J. Electron. Packag. March 2003, 125(1): 84–92.

https://doi.org/10.1115/1.1533802

Published Online: March 14, 2003

View Article titled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Topics: Finite element analysis, Flip-chip assemblies, Simulation, Solder joints, Solders, Stress, Deformation, Cycles, Flip-chip packages, Thermal expansion

Journal Articles

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Sheng Liu, I. Charles Ume

Publisher: ASME

J. Electron. Packag. September 2002, 124(3): 221–226.

https://doi.org/10.1115/1.1464878

Published Online: July 26, 2002

View Article titled, Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Topics: Flip-chip, Flip-chip devices, Inspection, Modeling, Signals, Solder joints, Solders, Vibration, Vibration analysis, Oscillating frequencies

Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´

Publisher: ASME

J. Electron. Packag. March 2001, 123(1): 42–46.

https://doi.org/10.1115/1.1326440

Published Online: July 18, 2000

View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages

Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes

Journal Articles

J-Lead Solder Joint Thermal Fatigue Life Model

T. E. Wong, L. A. Kachatorian, H. M. Cohen

Publisher: ASME

J. Electron. Packag. September 1999, 121(3): 186–190.

https://doi.org/10.1115/1.2792682

Published Online: September 1, 1999

View Article titled, J-Lead Solder Joint Thermal Fatigue Life Model

Topics: Fatigue life, Solder joints, Cycles, Finite element analysis, NASA, Damage, Failure, Fracture (Materials), Probability, Computers

Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang

Publisher: ASME

J. Electron. Packag. June 1998, 120(2): 166–170.

https://doi.org/10.1115/1.2792612

Published Online: June 1, 1998

View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes

Journal Articles

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Y. Guo, S. Liu

Publisher: ASME

J. Electron. Packag. June 1998, 120(2): 186–193.

https://doi.org/10.1115/1.2792619

Published Online: June 1, 1998

View Article titled, Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

Topics: Electronic packaging, Event history analysis, Stress, Reliability, Failure, Packaging, Cycles, Design, Electronic packages, Electronic products

Journal Articles

An Empirical Crack Propagation Model and its Applications for Solder Joints

Jimmy M. Hu

Publisher: ASME

J. Electron. Packag. June 1996, 118(2): 104–107.

https://doi.org/10.1115/1.2792128

Published Online: June 1, 1996

View Article titled, An Empirical Crack Propagation Model and its Applications for Solder Joints

Topics: Crack propagation, Solder joints, Reliability, Creep, Fracture mechanics, Inspection, Temperature, Tin

Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan

Publisher: ASME

J. Electron. Packag. June 1995, 117(2): 141–146.

https://doi.org/10.1115/1.2792081

Published Online: June 1, 1995

View Article titled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias

Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure

Journal Articles

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

D. T. Read, G. K. Lucey, Jr.

Publisher: ASME

J. Electron. Packag. June 1991, 113(2): 178–185.

https://doi.org/10.1115/1.2905384

Published Online: June 1, 1991

View Article titled, Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

Topics: Finite element analysis, Mesh generation, Solder joints, Surface mount technology, X-rays, Computer software, Failure, Inspection, Machinery, Modeling

Journal citation

NARROW

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Detection of Sealant Delamination in Integrated Circuit Package Using Nondestructive Evaluation

Evaluation of Nonintrusive Active Infrared Thermography Technique to Detect Hidden Solder Ball Defects on Plastic Ball Grid Array Components

Comparison of Ball Pull Strength Among Various Sn-Cu-Ni Solder Joints With Different Pad Surface Finishes

Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Application Using a Laser Ultrasound Inspection System

Detection of Solder Bump Defects in Electronic Packages Using Local Temporal Coherence Analysis of Laser Ultrasonic Signals

Quality Inspection of Flip Chip Solder Bumps Using Integrated Analytical, Numerical, and Experimental Modal Analyses

Open Defects in PBGA Assembly Solder Joints

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Vibration Analysis Based Modeling and Defect Recognition for Flip-Chip Solder-Joint Inspection

Microwave Imaging for the Integrity Assessment of IC Packages

J-Lead Solder Joint Thermal Fatigue Life Model

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

Development in Optical Methods for Reliability Analysis in Electronic Packaging Applications

An Empirical Crack Propagation Model and its Applications for Solder Joints

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

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