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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2025, 147(1): 011007.
Paper No: EP-24-1056
Published Online: August 9, 2024
Journal Articles
Jacob Lamotte-Dawaghreh, Joseph Herring, Sai Abhideep Pundla, Rohit Suthar, Vivek Nair, Pratik Bansode, Gautam Gupta, Dereje Agonafer, Joseph Madril, Tim Ouradnik, Michael Matthews, Ian Winfield
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041113.
Paper No: EP-24-1048
Published Online: August 9, 2024
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031004.
Paper No: EP-23-1045
Published Online: February 28, 2024
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031002.
Paper No: EP-23-1072
Published Online: January 12, 2024
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011009.
Paper No: EP-23-1023
Published Online: December 11, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. December 2023, 145(4): 040301.
Paper No: EP-23-1077
Published Online: November 1, 2023
Journal Articles
Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
Published Online: November 1, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021002.
Paper No: EP-23-1033
Published Online: August 17, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
Published Online: March 20, 2023
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
Published Online: December 23, 2022
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
Published Online: December 9, 2022
Journal Articles
Junwang Tian, Zhong Jin, Xin Tang, Wenxian Peng, Junfu Liu, Yunpeng Liu, Taotao Chen, Jinqing Xiao, Junhui Li
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041005.
Paper No: EP-21-1036
Published Online: November 22, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041112.
Paper No: EP-21-1105
Published Online: November 9, 2021
Topics:
Boiling,
Bubbles,
Critical heat flux,
Electrodeposition,
Heat transfer,
Copper,
Dynamics (Mechanics),
Microscale devices,
Fins,
Flow (Dynamics)
Includes: Supplementary data
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2021, 143(4): 041108.
Paper No: EP-21-1037
Published Online: November 2, 2021
Journal Articles
Manu Yadav, Thaer Alghoul, Sanoop Thekkut, Ronit Das, Christopher Greene, Peter Borgesen, A. R. Nazmus Sakib, Luke Wentlent, Shantanu Joshi
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031001.
Paper No: EP-20-1111
Published Online: September 15, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031005.
Paper No: EP-21-1024
Published Online: September 15, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021101.
Paper No: EP-21-1047
Published Online: September 13, 2021
Journal Articles
Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2021, 143(2): 020903.
Paper No: EP-20-1081
Published Online: February 22, 2021
Journal Articles
Design, Fabrication, and Testing of a Novel Design for Flexible Light-Emitting Diode Signage Modules
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031008.
Paper No: EP-20-1100
Published Online: February 19, 2021
Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2021, 143(3): 031010.
Paper No: EP-20-1102
Published Online: January 19, 2021
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