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Journal Articles

Hybrid Bonding for Ultra-High-Density Interconnect

Mei-Chien Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030802.
Paper No: EP-23-1064
https://doi.org/10.1115/1.4064750
Published Online: March 8, 2024
View Article titled, Hybrid Bonding for Ultra-High-Density Interconnect
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Topics: Bonding, Semiconductor wafers, Copper, Overlays (Materials engineering), Design
Journal Articles

A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices

Liang Yin, Christopher Kapusta, Arun Gowda, Kaustubh Nagarkar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031009.
Paper No: EP-17-1113
https://doi.org/10.1115/1.4040499
Published Online: July 2, 2018
View Article titled, A Wire-Bondless Packaging Platform for Silicon Carbide Power Semiconductor Devices
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Topics: Overlays (Materials engineering), Packaging, Power semiconductor devices, Reliability, Silicon, Wire, Gates (Closures), Manufacturing, Temperature, Heat sinks
Journal Articles

Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill

K. Darbha, J. H. Okura, S. Shetty, A. Dasgupta, T. Reinikainen, J. Zhu, J. F. J. M. Caers
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 237–241.
https://doi.org/10.1115/1.2793846
Published Online: December 1, 1999
View Article titled, Thermomechanical Durability Analysis of Flip Chip Solder Interconnects: Part 2—With Underfill
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Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles
Journal Articles

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 286–293.
https://doi.org/10.1115/1.2905408
Published Online: September 1, 1991
View Article titled, Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces
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Topics: Temperature, Emissivity, Image processing, Temperature measurement, Computer software, Computers, Hardware, Heat flux, Infrared imaging, Overlays (Materials engineering)