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Journal Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Yuan Chen, Zhongyang Wang, Yuhui Fan, Ming Dong, Dengxue Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030801.
Paper No: EP-23-1037
https://doi.org/10.1115/1.4064361
Published Online: March 8, 2024
View Article titled, Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
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Topics: Imaging, Inspection, Lasers, Microelectronic packaging, Resolution (Optics), Nondestructive evaluation, Microscopy
Journal Articles

Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation

Sara K. Lyons, Aditya Chandramohan, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041019.
Paper No: EP-21-1161
https://doi.org/10.1115/1.4054263
Published Online: April 22, 2022
View Article titled, Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation
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Topics: Resolution (Optics), Temperature, Thermography, Deformation, Temperature measurement, Emissivity
Journal Articles

Error Reduction in Infrared Thermography by Multiframe Super-Resolution

Aditya Chandramohan, Sara K. Lyons, Justin A. Weibel, Suresh V. Garimella
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041008.
Paper No: EP-18-1028
https://doi.org/10.1115/1.4041360
Published Online: October 1, 2018
View Article titled, Error Reduction in Infrared Thermography by Multiframe Super-Resolution
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Topics: Emissivity, Errors, Resolution (Optics), Temperature, Thermography, Uncertainty
Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011005.
Paper No: EP-16-1083
https://doi.org/10.1115/1.4035386
Published Online: January 5, 2017
View Article titled, Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance
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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature
Journal Articles

Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument

Ronald J. Warzoha, Andrew N. Smith, Maurice Harris
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011004.
Paper No: EP-16-1075
https://doi.org/10.1115/1.4035178
Published Online: December 29, 2016
View Article titled, Maximum Resolution of a Probe-Based, Steady-State Thermal Interface Material Characterization Instrument
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Topics: Heat, Instrumentation, Probes, Resolution (Optics), Steady state, Uncertainty, Heat flux, Measurement uncertainty, Fillers (Materials), Temperature measurement
Journal Articles

Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods

Sungbum Kang, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2014, 136(3): 031007.
Paper No: EP-13-1074
https://doi.org/10.1115/1.4027425
Published Online: May 12, 2014
View Article titled, Comparison of Warpage Measurement Capabilities and Results Obtained by Using Laser and Digital Fringe Projection Methods
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Topics: Diffraction gratings, Lasers, Resolution (Optics), Warping, Printed circuit boards, Accuracy and precision
Journal Articles

Room Level Modeling of Air Flow in a Contained Data Center Aisle

Vaibhav K. Arghode, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2014, 136(1): 011011.
Paper No: EP-13-1087
https://doi.org/10.1115/1.4026540
Published Online: February 14, 2014
View Article titled, Room Level Modeling of Air Flow in a Contained Data Center Aisle
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Topics: Air entrainment, Air flow, Containment, Data centers, Flow (Dynamics), Modeling, Temperature, Tiles, Momentum, Resolution (Optics)
Journal Articles

Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects

Hiroyuki Tsuritani, Toshihiko Sayama, Yoshiyuki Okamoto, Takeshi Takayanagi, Kentaro Uesugi, Takao Mori
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2011, 133(2): 021007.
https://doi.org/10.1115/1.4003992
Published Online: June 23, 2011
View Article titled, Application of Synchrotron Radiation X-Ray Microtomography to Nondestructive Evaluation of Thermal Fatigue Process in Flip Chip Interconnects
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Topics: Cycles, Fatigue, Fatigue cracks, Flip-chip, Flip-chip devices, Nondestructive evaluation, Solders, Synchrotron radiation, X-rays, Imaging
Journal Articles

A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process

Reinhard E. Powell, I. Charles Ume
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021006.
https://doi.org/10.1115/1.3103938
Published Online: April 1, 2009
View Article titled, A Novel Projection Moiré System for Measuring PWBA Warpage Using Simulated Optimized Convective Reflow Process
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Topics: Warping, Printed circuit boards, Measurement systems, Resolution (Optics)
Journal Articles

Microscale and Nanoscale Thermal Characterization Techniques

J. Christofferson, K. Maize, Y. Ezzahri, J. Shabani, X. Wang, A. Shakouri
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Thermal Issues In Emerging Technologies Theory And Applications, Theta
J. Electron. Packag. December 2008, 130(4): 041101.
https://doi.org/10.1115/1.2993145
Published Online: November 13, 2008
View Article titled, Microscale and Nanoscale Thermal Characterization Techniques
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Topics: Imaging, Microscale devices, Nanoscale phenomena, Probes, Resolution (Optics), Temperature, Thermal characterization, Thermoreflectance, Wavelength, Atomic force microscopy
Journal Articles

On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules

Wen-Hwa Chen, ASME Fellow, Professor, Hsien-Chie Cheng, ASME Member, Associate Professor, Chih-Han Lin, Graduate Student
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 374–383.
https://doi.org/10.1115/1.1773198
Published Online: October 6, 2004
View Article titled, On the Thermal Performance Characteristics of Three-Dimensional Multichip Modules
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Topics: Design, Finite element analysis, Finite element model, Heat, Heat conduction, Junctions, Manufacturing, Modeling, Multi-chip modules, Natural convection
Journal Articles

Measurement of Thermal Deformation of Interconnect Layers Using SIEM

Sheng Chang and, Fu-Pen Chiang, Yifan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2002, 124(3): 310–313.
https://doi.org/10.1115/1.1481367
Published Online: July 26, 2002
View Article titled, Measurement of Thermal Deformation of Interconnect Layers Using SIEM
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Topics: Deformation, Dielectric materials, Displacement, Electron microscopy, Interferometry, Packaging, Reliability, Resolution (Optics), Thermal deformation, Thermal expansion
Journal Articles

Microwave Imaging for the Integrity Assessment of IC Packages

Y. Ju, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2001, 123(1): 42–46.
https://doi.org/10.1115/1.1326440
Published Online: July 18, 2000
View Article titled, Microwave Imaging for the Integrity Assessment of IC Packages
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Topics: Delamination, Imaging, Microwaves, Sensors, Inspection, Reliability, Resolution (Optics), Dimensions, Shapes
Journal Articles

Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors

A.-F. Bastawros, K.-S. Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 354–359.
https://doi.org/10.1115/1.2792646
Published Online: December 1, 1998
View Article titled, Experimental Study on Electric-Current Induced Damage Evolution at the Crack Tip in Thin Film Conductors
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Topics: Damage, Electric current, Fracture (Materials), Thin films, Electrodes, Temperature, Aluminum, Melting, Brittle fracture, Coating processes
Journal Articles

Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization

H. Lu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1998, 120(3): 275–279.
https://doi.org/10.1115/1.2792633
Published Online: September 1, 1998
View Article titled, Applications of Digital Speckle Correlation to Microscopic Strain Measurement and Materials’ Property Characterization
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Topics: Hardware, Manufacturing, Reliability, Resolution (Optics), Strain measurement
Journal Articles

Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect

S. Wei, S. Wu, I. Kao, F. P. Chiang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. June 1998, 120(2): 166–170.
https://doi.org/10.1115/1.2792612
Published Online: June 1, 1998
View Article titled, Measurement of Wafer Surface Using Shadow Moire´ Technique With Talbot Effect
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Topics: Semiconductor wafers, Shades and shadows, Diffraction gratings, Diffraction patterns, Inspection, Resolution (Optics), Warping, Lasers, Light sources, Probes
Journal Articles

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

B. Han, Y. Guo, C. K. Lim, D. Caletka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 157–163.
https://doi.org/10.1115/1.2792146
Published Online: September 1, 1996
View Article titled, Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
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Topics: Computer simulation, Design, Displacement measurement, Microelectronic packaging, Interferometry, Displacement, Cycles, Electronic packaging, Geometry, Modeling
Journal Articles

Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry

B. Han, Y. Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 185–191.
https://doi.org/10.1115/1.2792090
Published Online: September 1, 1995
View Article titled, Thermal Deformation Analysis of Various Electronic Packaging Products by Moire´ and Microscopic Moire´ Interferometry
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Topics: Electronic packaging, Interferometry, Thermal deformation, Deformation, Packaging, Design, Displacement measurement, Mechanical behavior, Optimization, Product development
Journal Articles

Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods

E. V. Cherstvov, A. N. Mokhel, R. L. Salganik, V. N. Soutorshin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 310–313.
https://doi.org/10.1115/1.2905456
Published Online: September 1, 1992
View Article titled, Investigation and Prediction of Creep and Creep-Like Behavior of Solids by Laser Methods
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Topics: Creep, Lasers, Solids, Resolution (Optics)
Journal Articles

Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces

S. Heng, W. Z. Black
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 286–293.
https://doi.org/10.1115/1.2905408
Published Online: September 1, 1991
View Article titled, Temperature Mapping of Localized Hot Spots on Microelectronic Chip Surfaces
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Topics: Temperature, Emissivity, Image processing, Temperature measurement, Computer software, Computers, Hardware, Heat flux, Infrared imaging, Overlays (Materials engineering)