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Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
Open the PDF for Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Journal Articles

Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling

Fei Qin, Shuai Zhao, Yanwei Dai, Lingyun Liu, Tong An, Pei Chen, Yanpeng Gong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031012.
Paper No: EP-21-1125
https://doi.org/10.1115/1.4053028
Published Online: December 27, 2021
View Article titled, Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling
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Topics: Cycles, Nanoindentation, Silver, Stress, Young's modulus, Stress-strain curves
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021108.
Paper No: EP-21-1060
https://doi.org/10.1115/1.4052073
Published Online: October 6, 2021
View Article titled, High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
Open the PDF for High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days in another window
Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature
Journal Articles

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
https://doi.org/10.1115/1.3144151
Published Online: June 16, 2009
View Article titled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
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Topics: Fractography, Lead-free solders, Solders, Tensile strength, Reliability, Electronic products, Solder joints, Stress-strain curves
Journal Articles

Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)

L. Maciucescu, T.-L. Sham, E. Krempl
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 92–98.
https://doi.org/10.1115/1.2792673
Published Online: June 1, 1999
View Article titled, Modeling the Deformation Behavior of a Sn-Pb Solder Alloy Using the Simplified Viscoplasticity Theory Based on Overstress (VBO)
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Topics: Alloys, Deformation, Modeling, Solders, Tin, Viscoplasticity, Accounting, Creep, Solder joints, Stress analysis (Engineering)
Journal Articles

The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear

A. Gilat, K. Krishna
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 81–84.
https://doi.org/10.1115/1.2792223
Published Online: June 1, 1997
View Article titled, The Effects of Strain Rate and Thickness on the Response of Thin Layers of Solder Loaded in Pure Shear
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Topics: Shear (Mechanics), Solders, Deformation, Stress, Ductility, Shear stress, Stress-strain curves, Testing, Tin
Journal Articles

Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors

G. Ganguly, A. Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 147–152.
https://doi.org/10.1115/1.2792082
Published Online: June 1, 1995
View Article titled, Reliability Issues in Plated-Through-Holes Due to Insertion-Mount Compliant-Pin Connectors
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Topics: Copper, Damage, Deformation, Failure analysis, Finite element analysis, Fourier series, Manufacturing, Materials properties, Pins (Engineering), Printed circuit boards
Journal Articles

Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress

Peter A. Engel, Shou-Chien Chou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 136–140.
https://doi.org/10.1115/1.2792080
Published Online: June 1, 1995
View Article titled, Plastic Deformation of Solder Joints in Pin Grid Arrays Subjected to Thermal Stress
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Topics: Deformation, Solder joints, Thermal stresses, Solders, Temperature, Stress, Creep, Pins (Engineering), Stress-strain curves, Tin