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Journal Articles

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2024, 146(3): 031006.
Paper No: EP-22-1025
https://doi.org/10.1115/1.4064521
Published Online: March 11, 2024
View Article titled, Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging
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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Viscoplasticity, Finite element analysis
Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021116.
Paper No: EP-21-1062
https://doi.org/10.1115/1.4053764
Published Online: March 11, 2022
View Article titled, Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature
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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021108.
Paper No: EP-21-1060
https://doi.org/10.1115/1.4052073
Published Online: October 6, 2021
View Article titled, High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days
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Topics: Elastic moduli, Mechanical properties, Solders, Stress, Stress-strain curves, Temperature, Tensile strength, Testing, Operating temperature, High temperature
Journal Articles

Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy

Zheng Liu, Li Yang, Yifeng Xiong, Huiming Gao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011002.
Paper No: EP-20-1077
https://doi.org/10.1115/1.4051025
Published Online: August 6, 2021
View Article titled, Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy
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Topics: Alloys, Composite materials, Nanoparticles, Solders, Tin, Tensile strength
Journal Articles

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041104.
Paper No: EP-20-1003
https://doi.org/10.1115/1.4047392
Published Online: June 23, 2020
View Article titled, High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C
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Topics: Elastic moduli, Mechanical properties, Stress, Temperature, Tensile strength, Storage, Solders
Journal Articles

Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints

Tong An, Fei Qin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 011002.
Paper No: EP-15-1079
https://doi.org/10.1115/1.4032349
Published Online: March 10, 2016
View Article titled, Relationship Between the Intermetallic Compounds Growth and the Microcracking Behavior of Lead-Free Solder Joints
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Topics: Failure mechanisms, Solder joints, Solders, Surface roughness, Lead-free solders, Intermetallic compounds, Tensile strength, Microcracks, Tin
Journal Articles

Investigation on Laser Direct Welding of Quad Flat Pack Components

Jianwen Yuan, Chao Huang, Jimin Chen, Furong Liu, Yi Qiu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2013, 135(4): 044501.
Paper No: EP-13-1024
https://doi.org/10.1115/1.4025251
Published Online: September 6, 2013
View Article titled, Investigation on Laser Direct Welding of Quad Flat Pack Components
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Topics: Lasers, Temperature, Tensile strength, Welding, Solders, Laser welding, Tin
Journal Articles

Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates

Fei Qin, Tong An, Na Chen, Jie Bai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2009, 131(3): 031001.
https://doi.org/10.1115/1.3144151
Published Online: June 16, 2009
View Article titled, Tensile Behaviors of Lead-Containing and Lead-Free Solders at High Strain Rates
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Topics: Fractography, Lead-free solders, Solders, Tensile strength, Reliability, Electronic products, Solder joints, Stress-strain curves
Journal Articles

Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications

A. Polyakov, M. Bartek, J. N. Burghartz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Article
J. Electron. Packag. March 2005, 127(1): 7–11.
https://doi.org/10.1115/1.1846059
Published Online: March 21, 2005
View Article titled, Area-Selective Adhesive Bonding Using Photosensitive BCB for WL CSP Applications
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Topics: Adhesives, Bonding, Semiconductor wafers, Fracture toughness, Wedges, Tensile strength
Journal Articles

Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy

Qiang Xiao, Harold J. Bailey, William D. Armstrong
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2004, 126(2): 208–212.
https://doi.org/10.1115/1.1756144
Published Online: July 8, 2004
View Article titled, Aging Effects on Microstructure and Tensile Property of Sn3.9Ag0.6Cu Solder Alloy
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Topics: Alloys, Solders, Temperature, Eutectic alloys, Lead-free solders, Tin, Hardening, Tensile strength
Journal Articles

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 59–66.
https://doi.org/10.1115/1.1533058
Published Online: March 14, 2003
View Article titled, Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders
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Topics: Solders, Temperature, Tensile strength, Tin, Yield stress, Young's modulus, Creep, Stress
Journal Articles

Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses

David T. Read, James W. Dally
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1995, 117(1): 1–6.
https://doi.org/10.1115/1.2792062
Published Online: March 1, 1995
View Article titled, Fatigue of Microlithographically-Patterned Free-Standing Aluminum Thin Film Under Axial Stresses
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Topics: Aluminum, Fatigue, Stress, Thin films, Cycles, Fatigue life, Fracture (Materials), Titanium, Tensile strength