Topics: Boundary-value problems, Columns (Structural), Copper, Deformation, Density, Displacement, Errors, Finite element analysis, Finite element model, Modeling

Topics: Design, Electronic systems, Fins, Heat conduction, Heat transfer, Modeling, Steady state, Temperature, Transients (Dynamics), Aircraft

Topics: Durability, Flip-chip, Flip-chip devices, Solders, Thermomechanics, Fatigue, Finite element model, Solder joints, Architecture, Cycles

Topics: Finite element analysis, Flip-chip packages, Modeling, Deflection, Flip-chip assemblies, Printed circuit boards, Stress, Design, Multi-chip modules, Size effect

Topics: Flip-chip, Solder joints, Cross section (Physics), Three-dimensional models, Design, Optoelectronic devices, Shapes

Topics: Solders, Thermal stresses, Plane strain, Corners (Structural elements), Stress, Creep, Residual stresses, Three-dimensional models, Cooling, Finite element model