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Journal Articles

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Satish G. Kandlikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
https://doi.org/10.1115/1.4027175
Published Online: April 29, 2014
View Article titled, Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits
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Topics: Cooling, Cooling systems, Design, Flow (Dynamics), Heat, Microchannels, Pressure drop, Computer cooling, Temperature, Coolants
Journal Articles

Advances in the Fabrication Processes and Applications of Wafer Level Packaging

Peisheng Liu, Jinlan Wang, Liangyu Tong, Yujuan Tao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
https://doi.org/10.1115/1.4027397
Published Online: April 29, 2014
View Article titled, Advances in the Fabrication Processes and Applications of Wafer Level Packaging
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Topics: Manufacturing, Packaging, Reliability, Semiconductor wafers, Microelectromechanical systems, Solders, Solder joints, Copper, Polymers
Journal Articles

Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art

Dapeng Liu, Seungbae Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. March 2014, 136(1): 014001.
Paper No: EP-13-1038
https://doi.org/10.1115/1.4026615
Published Online: February 18, 2014
View Article titled, Three-Dimensional and 2.5 Dimensional Interconnection Technology: State of the Art
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Topics: Bonding, Manufacturing, Semiconductor wafers, Solders, Packaging, Low temperature
Journal Articles

Highlights from the European Thermal Project PROFIT

Clemens J. M. Lasance
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
https://doi.org/10.1115/1.1827258
Published Online: January 24, 2005
View Article titled, Highlights from the European Thermal Project PROFIT
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Topics: Modeling, Reliability, Safety, Steady state, Temperature, Computer software, Electronic products, Temperature gradient
Journal Articles

State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films

K. M. B. Jansen, V. Gonda, L. J. Ernst, H. J. L. Bressers, G. Q. Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2005, 127(4): 530–536.
https://doi.org/10.1115/1.2070092
Published Online: December 22, 2004
View Article titled, State-of-the-Art of Thermo-Mechanical Characterization of Thin Polymer Films
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Topics: Deflection, Electromagnetic scattering, Film thickness, Nanoindentation, Polymer films, Polymers, Radiation scattering, Scattering (Physics), Stress, Thermomechanics