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Keywords: POD-Galerkin
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2019, 141(1): 011002.
Paper No: EP-18-1029
Published Online: February 25, 2019
... and temporal temperature distribution while minimizing the computational effort within the chip architecture. In this study, a proper orthogonal decomposition (POD)-Galerkin projection-based reduced order model (ROM) was developed for modeling transient heat transfer in three-dimensional (3D) microchip...
