...). The feasibility of the strain gauge method is evaluated by the shadow moiré experiment and the finite element analysis. The stiffness effect of the thermal interface materials (TIMs) in the flip-chip packages with a cap is also considered. The result suggests that the general back-to-back gauge measurement method...

... circuit board (PCB). To enable electrical isolation, a thermal interface material (TIM) or gap pad is placed between the PCB and HS, resulting in poor heat transfer. Here, we develop an approach to eliminate TIMs and gap pads through modularization of metallic HSs. The use of smaller modular heat sinks...

... (TIMs) at bond line thicknesses less than 100  μ m. The working principle is based on the detection of regions of contrasting electric permittivity. An array of long, parallel electrodes is flush-mounted into each opposing substrate face of a narrow gap interface, and exposed to the gap formed between...

... transfer coefficients (HTC) at the heat spreader surface increase steady-state cooling but decrease maximum transient cooling. thermoelectric compact model TIM heat transfer coefficient Effective cooling of microelectronic processors is a crucial area of microelectronics research...