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Keywords: TSVs
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041008.
Paper No: EP-13-1122
Published Online: September 19, 2014
.... , and Agonafer , D. , 2012 , “ Parametric Thermal Analysis of TSVs in a 3-D Module Based on Interconnect Delay and Silicon Efficiency ,” 13th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems ( ITherm 2012 ), San Diego, CA , May 30–June 1, pp. 150 – 156 . 10.1109...