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Keywords: Test Dies
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. December 2004, 126(4): 565–570.
Published Online: January 24, 2005
... management (packaging) semiconductor device packaging product development quality management reliability safety electronics industry Thermal Characterization Compact Modeling Dynamic Measurements Test Dies Reliability Many roadmaps recognize thermal management as one of the major...
