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Keywords: copper–copper direct bonding
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021008.
Paper No: EP-24-1086
Published Online: February 4, 2025
...Qiang Zhang; Changping Chen; Haoze Yang; Jiameng Zhang; Mengtao Xiao; Long Dou; Junhui Li With the increasing interconnect density of electronic components, copper–copper direct bonding technology has garnered increasing attention from researchers. The electroplating bonding method is an efficient...
