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Journal Articles

Monitoring Fatigue Cracking in Interconnects in a Ball Grid Array by Measuring Electrical Resistance

B. Fiedler, M. Fine, K. Kao, L. Keer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
https://doi.org/10.1115/1.4006708
Published Online: July 18, 2012
...B. Fiedler; M. Fine; K. Kao; L. Keer References [1] Kanchanomai , C. , and Mutoh , Y. , 2007 , “ Fatigue Crack Initiation and Growth in Solder Alloys ,” Fatigue Fract. Eng. Mater. Struct. , 30 , pp. 443 – 457 . 10.1111/j.1460-2695.2006.01088.x [2] Lee , K. O. , Yu...
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Topics: Ball-Grid-Array packaging, Electrical resistance, Fracture (Materials), Shear (Mechanics), Stress, Cycles, Fatigue cracks, Failure, Fatigue, Shear stress