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Keywords: e− mobility
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041008.
Paper No: EP-13-1122
Published Online: September 19, 2014
... conditions) Fig. 22 Variation of device transconductance with TSV thermal conductivity (at different joule heating scenarios) Fig. 21 Variation of e − mobility with TSV thermal conductivity Fig. 20 Variation in performance hit with chip power for 40 mA case (normalized...
