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Keywords: interconnects
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031006.
Published Online: July 18, 2012
... Test Conditions ,” IEEE Electronic Components and Technology Conference , pp. 400 – 406 . [10] Lau , J. H. , 2011 , Reliability of Rohs-Compliant 2D and 3D IC Interconnects , Electronic Engineering , McGraw-Hill, New York , pp. 89 – 141 . [11] Fiedler , B. A. , 2010 , “ Fatigue...