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Keywords: microbeads
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2025, 147(2): 021007.
Paper No: EP-24-1085
Published Online: February 4, 2025
...Jeffrey R Hill; Alex Chen; Natasha Wilson; Cayden Boll; MeiLi O’Bannon; Dallan Trentman This study investigates the application of microbeads as an innovative encapsulation technique to protect electronic components from harsh mechanical strain. Traditional encapsulation methods using hard epoxy...
