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Keywords: microelectronics packaging
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Journal Articles

Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading

Junjie Dai, Yuexin Zhang, Zhankun Li, Mingming Chen, Yuhua Guo, Zhekun Fan, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031014.
Paper No: EP-21-1121
https://doi.org/10.1115/1.4053889
Published Online: March 8, 2022
... , Microelectronics Packaging Handbook ǁ Heat Transfer in Electronic Packages , Chapter 4, Kluwer Academic Publishers, Alphen aan den Rijn, The Netherlands, pp. 314 – 403 . [5] Li , J. , Zhang , X. , Zhou , C. , Zheng , J. , Ge , D. , and Zhu , W. , 2016 , “ New...
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Topics: Columns (Structural), Copper, Current density, Flip-chip devices, Solder joints, Solders, Temperature, Tin, Joules, Reliability
Journal Articles

Effect of Hexagonal-Boron Nitride/Epoxy and BNNS/Epoxy Composite Materials on the Reliability of Flip Chip

Zhankun Li, Zhekun Fan, Long Dou, Zhong Jin, Zhan Liu, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031007.
Paper No: EP-21-1039
https://doi.org/10.1115/1.4051468
Published Online: September 15, 2021
... in Microelectronics Packaging ,” IEEE Trans. Ind. Inf. , 14 ( 11 ), pp. 4746 – 4754 . 10.1109/TII.2018.2805297 [5] Chan , Y. C. , and Yang , D. , 2010 , “ Failure Mechanisms of Solder Interconnects Under Current Stressing in Advanced Electronic Packages ,” Prog. Mater. Sci. , 55 ( 5 ), pp...
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Topics: Flip-chip, Flip-chip devices, Reliability, Thermal conductivity, Temperature, Current density