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Keywords: nondestructive
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2014, 136(4): 041007.
Paper No: EP-13-1115
Published Online: September 19, 2014
... grease TIM nondestructive tomography Within the thermal management architecture of modern electronic systems exist numerous component interfaces between chip, heat spreader, and heat sink layers, which often contribute a significant portion of the overall package thermal resistance. The medium...
