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Keywords: singular value decomposition
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 440–448.
Published Online: January 24, 2005
... simulations are conducted on a set of hardware models to gain insight into the effects of component placement on the junction temperature. Two algorithms are introduced before and after CFD simulations: one defines the geometric parameters through singular value decomposition (SVD) of components placement...