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Journal Articles

The Effects of Temperature Cyclic Loading on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method

Wen-Ren Jong, Hsin-Chun Tsai, Hsiu-Tao Chang, Shu-Hui Peng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011001.
https://doi.org/10.1115/1.2837508
Published Online: January 31, 2008
...Wen-Ren Jong; Hsin-Chun Tsai; Hsiu-Tao Chang; Shu-Hui Peng In this study, the effects of the temperature cyclic loading on three lead-free solder joints of 96.5Sn–3.5Ag, 95.5Sn–3.8Ag-0.7Cu, and 95.5Sn–3.9Ag-0.6Cu bumped wafer level chip scale package (WLCSP) on printed circuit board assemblies...
View Article titled, The Effects of <span class="search-highlight">Temperature</span> <span class="search-highlight">Cyclic</span> <span class="search-highlight">Loading</span> on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method
Open the PDF for The Effects of <span class="search-highlight">Temperature</span> <span class="search-highlight">Cyclic</span> <span class="search-highlight">Loading</span> on Lead-Free Solder Joints of Wafer Level Chip Scale Package by Taguchi Method in another window
Topics: Creep, Lead-free solders, Semiconductor wafers, Shear (Mechanics), Solder joints, Taguchi methods, Temperature, Solders, Low temperature