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Keywords: interconnect
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Heat Mass Transfer. July 2017, 139(7): 072101.
Paper No: HT-13-1223
Published Online: March 21, 2017
... in the on-chip interconnect metal lines with characteristic sizes of tens of nanometer, can lead to thermomechanical fatigue and failure due to the thermal expansion coefficient mismatch between different materials. Full-field simulations of nearly a billion interconnects in a modern microprocessor...
