.... Chen. 23 December 2002 27 June 2003 19 11 2003 filled polymers thermal conductivity thermal resistance yield stress viscosity rheology cooling packaging interface structure Contact Resistance Heat Transfer Interface Rheological Thermophysical Particle...

... and Transport in a Submicrometer Transistor ,” J. Appl. Phys. , 77 ( 12 ), pp. 6686 – 6694 . Fushinobu, K., Hijikata, K., and Majumdar, A., 1995, “Heat Generation in Sub-Micron GaAs MESFETs,” Proceedings of International Intersociety Electronic Packaging Conference, ASME, New York, EEP-Vol. 10-2...

... in the JOURNAL OF HEAT TRANSFER . Manuscript received by the Heat Transfer Division January 4, 2001; revision received October 8, 2002. Associate Editor: T. Y. Chu. 04 January 2001 08 October 2002 17 07 2003 natural convection channel flow packaging pipe flow temperature...

... by the Heat Transfer Division for publication in the JOURNAL OF HEAT TRANSFER . Manuscript received by the Heat Transfer Division August 28, 2001; revision received April 4, 2002. Associate Editor: F. B. Cheung. 28 August 2001 04 April 2002 11 09 2002 packaging cooling heat...

... packaging. These TIMs are typically polymeric matrix loaded with highly conducting filler particles. The dwindling thermal budget has necessitated a better understanding of the thermal resistance of each component of the thermal solution. Thermal conductivity of these particle-laden materials is better...

... Resistance Heat Transfer Interface Packaging Roughness Constructal Design Constructal theory draws attention to the possibility of explaining natural phenomena of “self-organization” on the basis of a principle of design optimization, subject to global constraints 1 2 . The initial...

... based on an assessment of entropy generation rate. The present report summarizes the research conducted to date and presents a study on the optimization of cooling systems. cooling optimisation heat transfer entropy packaging design engineering Thermal Design Heat Transfer Pressure Loss...

... finite volume methods vortices packaging Conjugate Finite Difference Heat Transfer Mixed Convection Radiation Interaction of different modes of heat transfer continues to be a topic of interest because of its application in several areas, like the cooling of electronic equipment...

... heat transfer scattering cryogenics contact resistance Conduction Contact Resistance Heat Transfer Packaging Scattering Solid-solid thermal boundary resistance plays an important role in determining heat flow, both in cryogenic and room-temperature applications, such as very large...

... and greases have also been implemented. This review article covers recent developments in heat sink designs and applications intended for high-end high-power dissipation systems. A review of recent studies of card effects in the thermal enhancement of electronic packages is also presented. In certain...

... From Array of Flatpacks in a Channel Flow,” Proc. Fourth Annual International Electronics Packaging Society , Baltimore, pp. 318–326. Electronics Heat Transfer Packaging 06 August 1997 05 January 1998 05 12 2007 B. A. Jubran1 Department of Mechanical Engineering...