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Keywords: lead-free solder
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Journal Articles
Journal:
Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. June 2010, 7(6): 1–14.
Published Online: June 1, 2010
...Phil Geng This work compared ball grid array (BGA) lead-free solder joint strengths to eutectic lead (Sn–Pb) solder joint strengths under monotonic bend load at room temperature. Flexural test methodologies for evaluating solder joint strength are presented. Various effects on solder joint strength...
Journal Articles
Journal:
Journal of ASTM International
Publisher: ASTM International
Article Type: Research-Article
J. ASTM Int.. May 2010, 7(5): 1–15.
Published Online: May 1, 2010
.../j.microrel.2008.04.008 Suh , D. , Kim , D.-W. , Liu , P. L. , Kim , H. , Weninger , J. A. , Kumar , C. M. , Prasad , A. , Grimsley , B. W. , and Tejada , H. B. , “ Effects of Ag Content on Fracture Resistance of Sn–Ag–Cu Lead-Free Solders Under High-Strain Rate...
